AM29LV640MB90REI Spansion Inc., AM29LV640MB90REI Datasheet - Page 10
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AM29LV640MB90REI
Manufacturer Part Number
AM29LV640MB90REI
Description
Manufacturer
Spansion Inc.
Datasheet
1.AM29LV640MB90REI.pdf
(66 pages)
Specifications of AM29LV640MB90REI
Cell Type
NOR
Density
64Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4M
Supply Current
20mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29LV640MB90REI
Manufacturer:
AMD
Quantity:
20 000
Company:
Part Number:
AM29LV640MB90REIT
Manufacturer:
AMD
Quantity:
1 000
CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP and BGA). The package
8
RY/BY#
WE#
A13
NC
A6
A9
A5
A4
A3
A2
A1
NC
A8
A7
A7
A3
WP#/ACC
RESET#
A12
A17
NC
B6
B5
B4
B3
B2
B1
NC
A8
B8
B7
A4
A14
A10
A21
A18
NC
NC
C8
C7
C6
C5
C4
C3
A6
C2
A2
C1
D A T A
64-Ball Fortified BGA (
Am29LV640MT/B
Top View, Balls Facing Down
A15
A11
A19
A20
NC
NC
D8
D7
D6
D5
D4
D3
D2
D1
A5
A1
S H E E T
DQ7
DQ5
DQ2
DQ0
A16
V
NC
and/or data integrity can be compromised if the package
body is exposed to temperatures above 150°C for
prolonged periods of time.
A0
E8
E7
E6
E5
E4
E3
E2
E1
SS
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
NC
NC
f
F8
F7
F6
F5
F4
F3
F2
F1
BGA)
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
NC
NC
G8
G7
G6
G5
G4
G3
G2
G1
CC
DQ6
DQ4
DQ3
DQ1
V
V
NC
H8
NC
H7
H6
H5
H4
H3
H2
H1
SS
SS
26190C8 February 1, 2007