CY7C1361B-100AI Cypress Semiconductor Corp, CY7C1361B-100AI Datasheet - Page 29

• Manufacturer Part Number: CY7C1361B-100AI
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1361B-100AI

• Density: 9Mb
• Access Time (max): 8.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 100MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 180mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05302 Rev. *B
Timing Diagrams
ZZ Mode Timing
Ordering Information
Speed
(MHz)
133
ALL INPUTS
(except ZZ)
Outputs (Q)
CY7C1361B-133AC
CY7C1363B-133AC
CY7C1361B-133AI
CY7C1363B-133AI
CY7C1361B-133AJC
CY7C1363B-133AJC
CY7C1361B-133AJI
CY7C1363B-133AJI
CY7C1361B-133BGC
CY7C1363B-133BGC
CY7C1361B-133BGI
CY7C1363B-133BGI
CY7C1361B-133BZC
CY7C1363B-133BZC
CY7C1361B-133BZI
CY7C1363B-133BZI
I
[25, 26]
SUPPLY
CLK
Ordering Code
ZZ
(continued)
t ZZI
t ZZ
I
DDZZ
Package
BB165A
BB165A
BG119
BG119
Name
A101
A101
A101
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
2 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
2 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2 mm)
3 Chip Enables and JTAG
DON’T CARE
High-Z
Part and Package Type
DESELECT or READ Only
t RZZI
t ZZREC
CY7C1361B
CY7C1363B
Commercial
Commercial
Commercial
Commercial
Page 29 of 34
Operating
Industrial
Industrial
Industrial
Industrial
Range
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