74ALVCH16244DGG NXP Semiconductors, 74ALVCH16244DGG Datasheet - Page 15
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74ALVCH16244DGG
Manufacturer Part Number
74ALVCH16244DGG
Description
Manufacturer
NXP Semiconductors
Datasheet
1.74ALVCH16244DGG.pdf
(20 pages)
Specifications of 74ALVCH16244DGG
Logic Family
ALVC
Logical Function
Buffer/Line Driver
Number Of Elements
4
Number Of Channels
16
Number Of Inputs
16
Number Of Outputs
16
Operating Supply Voltage (typ)
1.8/2.5/3.3V
Package Type
TSSOP
Output Type
3-State
Polarity
Non-Inverting
Propagation Delay Time
7.1ns
High Level Output Current
-24mA
Low Level Output Current
24mA
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.2V
Quiescent Current
40uA
Technology
CMOS
Pin Count
48
Mounting
Surface Mount
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
74ALVCH16244DGG
Manufacturer:
Philips
Quantity:
12 495
Part Number:
74ALVCH16244DGG
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
74ALVCH16244DGGRG4
Manufacturer:
PHILIPS
Quantity:
5
Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
2003 May 14
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
2.5 V/3.3 V 16-bit buffer/line driver
(3-state)
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(4)
, SO, SOJ
PACKAGE
(1)
15
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
74ALVCH16244
74ALVC16244;
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(2)