PC354NT Sharp Electronics, PC354NT Datasheet

PC354NT

Manufacturer Part Number
PC354NT
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of PC354NT

Input Type
AC
Output Type
DC
Output Device
Transistor
Number Of Elements
1
Forward Voltage
1.4V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
Mini Flat
Collector Current (dc) (max)
50mA
Isolation Voltage
3750Vrms
Power Dissipation
170mW
Collector-emitter Saturation Voltage
0.2V
Current Transfer Ratio
400%
Fall Time
18000ns
Rise Time
18000ns
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-30C to 100C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

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Part Number
Manufacturer
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■ Description
■ Features
PC354NJ0000F
Series
coupled to a phototransistor.
400% at input current of ±1mA.
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow
3. AC input type
4. High collector-emitter voltage (V
5. High isolation voltage between input and output
6. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
PC354NJ0000F Series contains an IRED optically
It is packaged in a 4-pin Mini-flat package.
Input-output isolation voltage(rms) is 3.75kV.
Collector-emitter voltage is 80V and CTR is 20% to
Soldering)
(V
iso(rms)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 3.75kV)
CEO
: 80V)
1
■ Agency approvals/Compliance
■ Applications
Mini-flat Package,
AC Input Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade (94V-0)
1. Hybrid substrates that require high density mounting.
2. Programmable controllers
file No. E64380 (as model No. PC354)
PC354NJ0000F Series
Sheet No.: D2-A00602EN
© SHARP Corporation
Date Jun. 30. 2005

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PC354NT Summary of contents

Page 1

PC354NJ0000F Series ■ Description PC354NJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is 20% to 400% at input current ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark "S" Primary side mark 1 2 ±0.1 0.4 Epoxy resin Product mass : approx. 0.1g 4 Anode Anode/Cathode 1 Cathode/Anode ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P ...

Page 5

... Model Line-up Taping Package 3 000 pcs/reel 750 pcs/reel PC354NJ0000F PC354NTJ000F Model No. PC354N1J000F PC354N1TJ00F Please contact a local SHARP sales representative to inquire about production status. I [mA] C Rank mark (I =±1mA, V =5V, T =25˚ 0.2 to 4.0 with or without 0 PC354NJ0000F Series Sheet No.: D2-A00602EN ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature ...

Page 7

Fig.7 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 Collector ...

Page 8

Fig.13 Test Circuit for Response Time V CC Input R L Input R Output Output Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph are just ...

Page 9

Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...

Page 12

Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...

Page 13

Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ±0.1 ±0.05 7.4 ...

Page 14

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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