S29GL256M10TAIR10 Spansion Inc., S29GL256M10TAIR10 Datasheet - Page 112

• Manufacturer Part Number: S29GL256M10TAIR10
• Manufacturer: Spansion Inc.

Specifications of S29GL256M10TAIR10

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 25/24Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3/11.5 to 12.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 32M/16M
• Supply Current: 60mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

Revision Summary
Revision A (January 29, 2004)
Revision A1 (February 23, 2004)
110
Initial Release.
Connection Diagrams
Removed 80-ball Fine-pitch BGA pinout.
Ordering Information
Added additional packing type.
Removed frame description from package material set.
Updated valid combinations to reflect the addition of new package type.
Added marking descriptions to all valid combination tables.
Word Program Command Sequence and Unlock Bypass
Command Sequence
Added these sections.
Figure 3, Write Buffer Programming Operation, Figure 4,
Program Operation
Updated figure.
Table 34, “Command Definitions( x16 Mode, BYTE# = V
page 69
Updated table.
Added note 19.
Table 35, “Command Definitions (x8 Mode, BYTE# = V
page 70
Updated table.
Added note 17.
Figure 7, Data# Polling Algorithm
Updated figure.
Erase and Program Operations and Alternate CE# Controlled
Erase and Program Operations
Updated T
Added Note 4.
Program Operation Timings, Chip/Sector Erase Operation
Timings, Toggle Bit Timings (During Embedded Algorithms),
Alternate CE# Controlled Write (Erase/
Program) Operation Timings figures
Updated figures.
Physical Dimensions
Removed BGA-63P-M02 and BGA-80P-M01. Added the TS040 package
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S29GL-M_00_B8 February 7, 2007