M24C08-WDW6T STMicroelectronics, M24C08-WDW6T Datasheet
M24C08-WDW6T
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M24C08-WDW6T Summary of contents
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... M24C01 September 2006 M24C04, M24C02, M24C01 Part Number M24C16-W M24C16-R M24C08-W M24C08-R M24C04-W M24C04-R M24C02-W M24C02-R M24C01-W M24C01-R Rev 8 M24C16, M24C08 PDIP8 (BN) SO8 (MN) 150 mil width TSSOP8 (DW) 169 mil width TSSOP8 (DS) 3x3mm² body size UFDFPN8 (MB) 2x3mm² (MLP) www.st.com 1/33 1 ...
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... Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.7.1 3.7.2 3.7.3 3.7.4 4 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/33 M24C16, M24C08, M24C04, M24C02, M24C01 Write Control (WC Operating supply voltage Power-up and device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 15 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current Address Read ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 7 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Contents 3/33 ...
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... Table 18. TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data . . . . . . . . . . . . . . 28 Table 19. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 20. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 21. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4/33 M24C16, M24C08, M24C04, M24C02, M24C01 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections (top view Figure 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4. Maximum R value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9 P Figure 5. I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Write mode sequences with (data write inhibited Figure 7 ...
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... Summary description 1 Summary description These I²C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and M24C01). In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free and RoHS compliant. ECOPACK trademark. ECOPACK specifications are available at: www.st.com. ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 2. 8-pin package connections (top view) 16Kb Not Connected 2. See Section 7: Package mechanical M24Cxx /8Kb /4Kb /2Kb /1Kb for package dimensions, and how to identify pin-1. Summary description SCL 5 SDA AI02034E 7/33 ...
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... Control (WC) is driven High. When unconnected, the signal is internally read as V Write operations are allowed. When Write Control (WC) is driven High, Device Select and Address bytes are acknowledged, Data bytes are not acknowledged. 8/33 M24C16, M24C08, M24C04, M24C02, M24C01 indicates how the value of the pull-up resistor can be calculated M24Cxx ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 2.4 Supply voltage (V 2.4.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V In order to secure a stable DC supply voltage recommended to decouple the V with a suitable capacitor (usually of the order of 10nF to 100nF) close to the V package pins ...
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... M24C16 Select Code 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. 3. A10, A9 and A8 represent most significant bits of the address. 10/33 M24C16, M24C08, M24C04, M24C02, M24C01 SDA SDA START Input Change ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 3 Device operation The device supports the I²C protocol. This is summarized in data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device ...
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... A9, and E2 is not available for devices that need to use address line A10 (see up to eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connected to one I²C bus. In each case, and in the hybrid cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devices are used) ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 6. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 3.6 Write operations Following a Start condition the bus master sends a Device Select Code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in address byte ...
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... Stop condition. Figure 7. Write mode sequences with (data write enabled) WC BYTE WRITE WC PAGE WRITE WC (cont'd) PAGE WRITE (cont'd) 14/33 M24C16, M24C08, M24C04, M24C02, M24C01 ACK ACK DEV SEL BYTE ADDR DATA IN R/W ACK ACK DEV SEL BYTE ADDR ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 8. Write cycle polling flowchart using ACK First byte of instruction with already decoded by the device ReSTART 3.6.3 Minimizing system delays by polling on ACK During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells ...
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... Device Select Code, with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the contents of the addressed byte. The bus master must not acknowledge the byte, and terminates the transfer with a Stop condition. 16/33 M24C16, M24C08, M24C04, M24C02, M24C01 ACK NO ACK DEV SEL ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 3.7.2 Current Address Read For the Current Address Read operation, following a Start condition, the bus master only sends a Device Select Code with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the byte addressed by the internal address counter. The counter is then incremented ...
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... LEAD 1. T max must not be applied for more than 10s. LEAD 2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500 , R2=500 ). 18/33 M24C16, M24C08, M24C04, M24C02, M24C01 Table 5 may cause permanent damage to Parameter Min. Max. Unit – ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 6 DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters ...
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... Stand-by Supply Current CC1 V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL 1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1k . 20/33 M24C16, M24C08, M24C04, M24C02, M24C01 Test Condition Parameter (in addition to those Standby mode OUT SS ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Table 11. AC measurement conditions Symbol C Load Capacitance L Input Rise and Fall Times Input Levels Input and Output Timing Reference Levels Figure 10. AC measurement I/O waveform Table 12. Input parameters Symbol C Input Capacitance (SDA Input Capacitance (other pins) ...
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... Previous devices bearing the process letter “L” in the package marking guarantee a maximum write time of 10ms. For more information about these devices and their device identification, please ask your ST Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062). 22/33 M24C16, M24C08, M24C04, M24C02, M24C01 Test conditions specified in Table 6 Parameter ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Table 14. AC characteristics (M24Cxx-R) Symbol Alt SCL t t CHCL HIGH t t CLCH LOW ( DL1DL2 DXCX SU:DAT t t CLDX HD:DAT t t CLQX DH ( CLQV AA ( CHDX SU:STA t t DLCL HD:STA t t CHDH SU:STO t t DHDL BUF Sampled only, not 100% tested. ...
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... Figure 11. AC waveforms tCHCL SCL tDLCL SDA In tCHDX START Condition SCL SDA In tCHDH STOP Condition SCL tCLQV SDA Out 24/33 M24C16, M24C08, M24C04, M24C02, M24C01 tCLCH tCLDX tDXCX SDA Change SDA Input tW Write Cycle tCLQX Data Valid tCHDH tDHDL START STOP Condition ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 7 Package mechanical Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, package outline 1. Drawing is not to scale. Table 15. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, package mechanical data Symbol millimeters Typ. Min. Max. 5.33 0.38 3.30 2 ...
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... The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total number of pins. Table 16. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, package mechanical data Symbol ccc 26/33 M24C16, M24C08, M24C04, M24C02, M24C01 A ccc millimeters Typ Min Max 1.75 0.10 0.25 1.25 0.28 0.48 0.17 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², outline 1. Drawing is not to scale. 2. The central pad (the area the above illustration) is pulled, internally allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process ...
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... CP 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 18. TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data Symbol 28/33 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Typ. Min. Max. 1.200 0.050 0.150 1.000 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 16. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, package outline Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 19. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, ...
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... ST Sales Office. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. 30/33 M24C16, M24C08, M24C04, M24C02, M24C01 M24C16 – (1) (2) ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 9 Revision history Table 21. Document revision history Date Version 10-Dec-1999 2.4 18-Apr-2000 2.5 05-May-2000 2.6 23-Nov-2000 3.0 19-Feb-2001 3.1 20-Apr-2001 3.2 08-Oct-2001 3.3 09-Nov-2001 3.4 30-Jul-2002 3.5 04-Feb-2003 3.6 05-May-2003 3.7 07-Oct-2003 4.0 17-Mar-2004 5.0 Changes TSSOP8 Turned-Die package removed (p 2 and order information) Lead temperature added for TSSOP8 in table 2 Labelling change to Fig-2D, correction of values for ‘ ...
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... Document revision history Date Version 7-Oct-2005 6.0 17-Jan-2006 7.0 19-Sep-2006 32/33 M24C16, M24C08, M24C04, M24C02, M24C01 Product List summary table added. AEC-Q100-002 compliance. Device Grade information clarified. Updated Figure 3, Figure 4, Table 14 Updated tW=5ms for the M24Cxx-W. Pin numbers removed from silhouettes (see ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...