M24C08-RMC6TG STMicroelectronics, M24C08-RMC6TG Datasheet
M24C08-RMC6TG
Specifications of M24C08-RMC6TG
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M24C08-RMC6TG Summary of contents
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... M24C02-R M24C01-W M24C01-x M24C01-R April 2011 M24C04-x M24C02-x M24C01 Standard-mode ® 1. Only M24C08-F and M24C16-F devices are offered in the WLCSP package. 2. Only M24C08-F devices are offered in the Thin WLCSP package. Doc ID 5067 Rev 17 M24C16-x M24C08-x PDIP8 (BN) SO8 (MN) 150 mils width TSSOP8 (DW) ...
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... Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.7.1 3.7.2 3.7.3 3.7.4 4 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/38 M24C16, M24C08, M24C04, M24C02, M24C01 Write Control (WC Operating supply voltage Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 16 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Current Address Read ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Doc ID 5067 Rev 17 Contents 3/38 ...
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... M24Cxx- Table 16. AC characteristics at 100 kHz (I M24Cxx-R, M24Cxx- Table 17. M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 27 Table 18. M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data . . . . . . . . 28 Table 19. M24C16: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 28 Table 20. ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections (top view Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside Figure 4. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5. Maximum R value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9 P Figure 6 ...
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... Description 1 Description These I²C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and M24C01). Figure 1. Logic diagram I²C uses a two-wire serial interface, comprising a bidirectional data line and a clock line. The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the I²C bus definition. The device behaves as a slave in the I² ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 2. 8-pin package connections (top view) 16Kb / 8Kb / 4Kb / 2Kb / 1Kb Not connected 2. See Section 7: Package mechanical data 3. The Ei inputs are not decoded, and are therefore decoded as “0” (See E2) for more information). Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside) 1 ...
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... When Write Control (WC) is driven High, device select and address bytes are acknowledged, data bytes are not acknowledged. 8/38 M24C16, M24C08, M24C04, M24C02, M24C01 indicates how the value of the pull-up resistor can be calculated). In Figure 4. When not connected (left floating), Ei inputs are ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 2.4 Supply voltage (V 2.4.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V Table 8). In order to secure a stable DC supply voltage recommended to decouple the V line with a suitable capacitor (usually of the order 100 nF) close to the ...
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... M24C16 select code 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. 3. A10, A9 and A8 represent most significant bits of the address. 10/38 M24C16, M24C08, M24C04, M24C02, M24C01 SDA SDA Start Input Change ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 3 Device operation The device supports the I²C protocol. This is summarized in data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device ...
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... A9, and E2 is not available for devices that need to use address line A10 (see up to eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connected to one I²C bus. In each case, and in the hybrid cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devices are used) ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 7. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 3.6 Write operations Following a Start condition the bus master sends a device select code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in address byte ...
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... After each byte is transferred, the internal byte address counter (the 4 least significant address bits only) is incremented. The transfer is terminated by the bus master generating a Stop condition. 14/38 M24C16, M24C08, M24C04, M24C02, M24C01 Figure Doc ID 5067 Rev 17 7, and the location is not ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 8. Write mode sequences with (data write enabled) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) ACK ACK Dev Select Byte address Data in R/W ACK ACK Dev Select Byte address Data in 1 R/W ACK ACK Data in N ...
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... Step 1. If the device has terminated the internal Write cycle, it responds with an Ack, indicating that the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during Step 1). 16/38 M24C16, M24C08, M24C04, M24C02, M24C01 Write cycle in progress Start condition ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 10. Read mode sequences Current Address Read Random Address Read Sequentila Current Read Sequential Random Read 1. The seven most significant bits of the device select code of a Random Read (in the 1 be identical. 3.7 Read operations Read operations are performed independently of the state of the Write Control (WC) signal. ...
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... For all Read commands, the device waits, after each byte read, for an acknowledgment th during the 9 bit time. If the bus master does not drive Serial Data (SDA) Low during this time, the device terminates the data transfer and switches to its Standby mode. 18/38 M24C16, M24C08, M24C04, M24C02, M24C01 Figure 10. Doc ID 5067 Rev 17 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 4 Initial delivery state The device is delivered with all bits in the memory array set to 1 (each byte contains FFh). 5 Maximum rating Stressing the device outside the ratings listed in the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operating sections of this specification, is not implied ...
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... Table 7. Operating conditions (M24Cxx-R) Symbol V Supply voltage CC Ambient operating temperature Table 8. Operating conditions (M24Cxx-F) Symbol V Supply voltage CC Ambient operating temperature 20/38 M24C16, M24C08, M24C04, M24C02, M24C01 Parameter Parameter Parameter Doc ID 5067 Rev 17 Min. Max. Unit 2.5 5.5 V –40 85 °C –40 125 ° ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Table 9. DC characteristics (M24Cxx-W, device grade 6) Symbol Parameter Input leakage current I LI (SCL, SDA, E0, E1,and E2) I Output leakage current LO I Supply current CC I Standby supply current CC1 Input low voltage (SDA SCL, WC) Input high voltage (SDA, ...
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... V IH SCL, WC) V Output low voltage OL 1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the completion of the internal write cycle t 22/38 M24C16, M24C08, M24C04, M24C02, M24C01 Test condition Parameter (in addition to those Standby mode SDA in Hi-Z, external voltage ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Table 12. DC characteristics (M24Cxx-F) Symbol Parameter Input leakage current (SCL, SDA E0, E1,and E2) I Output leakage current LO I Supply current CC I Standby supply current CC1 V Input low voltage (SDA, SCL, WC Input high voltage (SDA, SCL, WC Output low voltage OL 1 ...
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... SDA the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3V CLQV 0.7V , assuming that R CC 24/38 M24C16, M24C08, M24C04, M24C02, M24C01 2 C Fast-mode) (M24Cxx-W, M24Cxx-R, Table 6, Parameter Clock frequency Clock pulse width high ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Table 16. AC characteristics at 100 kHz (I M24Cxx-R, M24Cxx-F) Test conditions specified in either Symbol Alt SCL t t CHCL HIGH t t CLCH LOW t t XH1XH2 XL1XL2 F ( QL1QL2 DXCX SU:DAT t t CLDX HD:DAT t t CLQX DH ( CLQV AA ( CHDX SU:STA t t DLCL ...
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... DC and AC parameters Figure 12. AC waveforms 26/38 M24C16, M24C08, M24C04, M24C02, M24C01 Doc ID 5067 Rev 17 ...
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... ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 13. WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps, package outline 1. Drawing is not to scale. Table 17. M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data Symbol ...
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... Package mechanical data Table 18. M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data Symbol ( Preliminary data. 2. Values in inches are converted from mm and rounded to 4 decimal digits the total number of terminals. Table 19. M24C16: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 14. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline A2 1. Drawing is not to scale. 2. The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total number of pins ...
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... eee 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Applied for exposed die paddle and terminals. Excludes embedding part of exposed die paddle from measuring. 30/38 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Min Max 0.450 0.600 0.000 0.050 0.200 0.300 1 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 22. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol ...
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... Figure 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline 1. Drawing is not to scale. Table 23. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data Symbol Values in inches are converted from mm and rounded to 4 decimal digits. 32/38 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Typ. Min. Max 5.330 - ...
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... Process /S = F6SP36% 1. Only M24C08 and M24C16 devices are offered in the WLCSP package. 2. Only M24C08-F devices are offered in the Thin WLCSP package strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Changes TSSOP8 Turned-Die package removed (p 2 and order information) Lead temperature added for TSSOP8 in table 2 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13 Extra labelling to Fig-2D ...
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... Plating technology, /W removed under Process. Section 2.3: Chip Enable (E0, E1, E2) Concerned signals specified for characteristics tables 10 t modified in Table 16: AC characteristics (M24Cxx-R and W M24C08-F and M24C04-F offered in UFDFPN8 package in the temperature range 5 (see Doc ID 5067 Rev 17 Revision history Changes Device internal reset section, and Table 24 Added ECOPACK® ...
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... Revision history Date Version 30-Jan-2009 11-Mar-2009 28-May-2009 02-Mar-2010 01-Apr-2010 36/38 M24C16, M24C08, M24C04, M24C02, M24C01 Section 2.4: Supply voltage (VCC) Figure 5: Maximum RP value versus bus parasitic capacitance (C) for an I²C bus updated. I added to Table 5: Absolute maximum OL clarified in DC characteristics Note modified below ...
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... Deleted Figure and Table relating to TSSOP8 3x3 mm package information. Deleted line and note in Table 24: Ordering information scheme TSSOP8 3x3 mm package. In Table 26: Available M24C08 products (package, voltage range, 16 temperature grade) updated UFDFPN8 (MC) package for M24C08-F range to 5 and deleted line concerning TSSOP8 3x3 mm package. In ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 38/38 M24C16, M24C08, M24C04, M24C02, M24C01 Please Read Carefully: © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies www ...