M24C08-RMC6TG STMicroelectronics, M24C08-RMC6TG Datasheet - Page 37

no-image

M24C08-RMC6TG

Manufacturer Part Number
M24C08-RMC6TG
Description
8KBIT SERIAL I2C BUS EEPROM
Manufacturer
STMicroelectronics
Datasheet

Specifications of M24C08-RMC6TG

Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M24C08-RMC6TG
Manufacturer:
STM
Quantity:
60
Part Number:
M24C08-RMC6TG
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
M24C08-RMC6TG
Quantity:
1 500
M24C16, M24C08, M24C04, M24C02, M24C01
29-Apr-2010
15-Apr-2011
Date
Version
16
17
Deleted TSSOP8 3x3 mm package from cover page.
Deleted Figure and Table relating to TSSOP8 3x3 mm package
information.
Deleted line and note in
TSSOP8 3x3 mm package.
In
temperature grade)
to 5 and deleted line concerning TSSOP8 3x3 mm package.
In
temperature grade)
to 5.
In
temperature grade)
Updated:
- Text modified in
- Text modified in
- V
-
no lead 2 x 3 mm,
- E2 (Rev MC): “ddd” has been changed to “eee” and its values modified in
Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no
lead 2 x 3 mm,
Added:
- Note at the end of the
- Figure footnote below the
(top view, marking side, with balls on the
Figure 15: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
Table 26: Available M24C08 products (package, voltage range,
Table 27: Available M24C04 products (package, voltage range,
Table 28: Available M24C02 products (package, voltage range,
ESD
minimum value deleted
Doc ID 5067 Rev 17
data.
Section 2.3: Chip Enable (E0, E1,
Section 3.6: Write
outline.
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDRPN8 options to MB or MC.
Table 24: Ordering information scheme
Section 1:
Figure 3: WLCSP and thin WLCSP connections
ofTable 5: Absolute maximum
Changes
Description.
operations.
underside).
E2).
Revision history
ratings.
concerning
37/38

Related parts for M24C08-RMC6TG