PIC18F2585-H/SO Microchip Technology, PIC18F2585-H/SO Datasheet - Page 459
PIC18F2585-H/SO
Manufacturer Part Number
PIC18F2585-H/SO
Description
IC MCU 8BIT 48KB FLASH 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet
1.PIC18F4585-IPT.pdf
(482 pages)
Specifications of PIC18F2585-H/SO
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
28-SOIC (0.295", 7.50mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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© 2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
PIC18F2585/2680/4585/4680
Dimension Limits
Preliminary
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
DS39625C-page 457
c
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