AD8187ARU Analog Devices Inc, AD8187ARU Datasheet - Page 4

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AD8187ARU

Manufacturer Part Number
AD8187ARU
Description
IC MULTIPLEXER TRPL 2X1 24TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8187ARU

Rohs Status
RoHS non-compliant
Function
Multiplexer
Circuit
3 x 2:1
On-state Resistance
350 mOhm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
3.5 V ~ 5.5 V
Current - Supply
15mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP (0.173", 4.40mm Width)

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AD8186/AD8187
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
DV
DV
V
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, V
SEL A/B, OE . . . . . . . . . . . . . . . . . . . . . . D
Output Short Circuit Operation . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range . . . . . . . . . . . . –65ºC to +150ºC
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300ºC
NOTES
1
2
3
4
MAXIMUM POWER DISSIPATION
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150ºC. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175ºC for an extended period can result
in device failure.
While the AD8186/AD8187 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150ºC) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 2.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8186/AD8187 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the Theory of
Operation section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Specification is for device in free air (T
24-lead TSSOP; T
derated for ambient temperature (T
T
CC
JA
CC
CC
of 85 C/W is on a 4-layer board (2s 2p).
to D
Model
AD8186ARU
AD8186ARU-REEL –40ºC to +85ºC
AD8186ARU-REEL 7 –40ºC to +85ºC
AD8187ARU
AD8187ARU-REEL –40ºC to +85ºC
AD8187ARU-REEL 7 –40ºC to +85ºC
AD8186-EVAL
AD8187-EVAL
to D
to V
GND
EE
GND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
= 85ºC/W. Maximum internal power dissipation (PD) should be
–40ºC to +85ºC
–40ºC to +85ºC
A
Temperature Range Package Description
) such that PD < (150ºC T
A
= 25ºC).
1, 2, 3, 4
REF
. . . V
GND
EE
A
≤ V
)/T
≤ V
24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24
13" Reel TSSOP
24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24
13" Reel TSSOP
Evaluation Board
Evaluation Board
7" Reel TSSOP
7" Reel TSSOP
JA
IN
.
ORDERING GUIDE
IN
≤ DV
≤ V
CC
CC
–4–
Figure 2. Maximum Power Dissipation vs. Temperature
2.5
1.5
2.0
1.0
0.5
0
–50 –40
–30 –20 –10 0
D
IN0A
IN1A
V
IN2A
IN2B
IN1B
IN0B
GND
PIN CONFIGURATION
V
REF
V
V
V
CC
EE
EE
EE
10
11
12
AMBIENT TEMPERATURE ( C)
1
2
3
4
5
6
7
8
9
(Not to Scale)
TOP VIEW
AD8186/
AD8187
10
20
30 40 50 60 70 80
24
23
22
21
20
19
18
17
16
15
14
13
V
OE
SEL A/B
OUT 0
OUT 1
OUT 2
DV
V
V
V
V
V
Package Option
RU-24
RU-24
RU-24
RU-24
CC
CC
EE
CC
EE
CC
CC
REV. A
90

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