EVAL-ADV7619EB1Z Analog Devices Inc, EVAL-ADV7619EB1Z Datasheet - Page 8

• Manufacturer Part Number: EVAL-ADV7619EB1Z
• Description: BOARD EVAL FOR ADV7619
• Manufacturer: Analog Devices Inc
• Series: Advantiv®, Xpressview™r

Specifications of EVAL-ADV7619EB1Z

• Main Purpose: Video, HDMI Receiver
• Embedded: No
• Utilized Ic / Part: ADV7619
• Primary Attributes: Dual Port, 3 GHz HDMI Receiver
• Secondary Attributes: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ADV7619
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
DVDD to GND
PVDD to GND
DVDDIO to GND
CVDD to GND
TVDD to GND
Digital Inputs to GND
5 V Tolerant Digital Inputs
Digital Outputs to GND
XTALP, XTALN
SCL, SDA Data Pins to
Maximum Junction
Storage Temperature Range
Infrared Reflow Soldering
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
DDCA_SDA, DDCB_SCL, and DDCB_SDA.
to GND
DVDDIO
Temperature (T
(20 sec)
1
J MAX
)
Rating
2.2 V
2.2 V
4.0 V
2.2 V
4.0 V
GND − 0.3 V to DVDDIO + 0.3 V
5.3 V
GND − 0.3 V to DVDDIO + 0.3 V
−0.3 V to PVDD + 0.3 V
DVDDIO − 0.3 V to DVDDIO + 3.6 V
125°C
−60°C to +150°C
260°
Rev. A | Page 8 of 24
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7619, the
user is advised to turn off the unused sections of the part.
Due to PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θ
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this solution eliminates the variance associated with
the θ
The maximum junction temperature (T
be exceeded. The following equation calculates the junction
temperature using the measured package surface temperature
and applies only when no heat sink is used on the device under
test (DUT):
where:
T
Ψ
W
(CVDD × I
where 0.2 is 20% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION
S
JT
TOTAL
is the package surface temperature (°C).
= 0.22°C/W for the 128-lead TQFP_EP.
T
JA
J
value.
= T
= ((PVDD × I
S
CVDD
+ (Ψ
) + (DVDD × I
JT
× W
PVDD
TOTAL
) + (0.2 × TVDD × I
)
DVDD
JA
may differ for various PCBs.
) + (DVDDIO × I
J MAX
) of 125°C must not
TVDD
Data Sheet
) +
DVDDIO
))