SI3220-G-GQ Silicon Laboratories Inc, SI3220-G-GQ Datasheet - Page 106
![IC PROSLIC/CODEC DUAL 64TQFP](/photos/16/12/161288/tqfp-64_sml.jpg)
SI3220-G-GQ
Manufacturer Part Number
SI3220-G-GQ
Description
IC PROSLIC/CODEC DUAL 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
ProSLIC®r
Datasheet
1.SI3200-G-FSR.pdf
(112 pages)
Specifications of SI3220-G-GQ
Package / Case
64-TQFP, 64-VQFP
Function
Subscriber Line Interface Concept (SLIC), CODEC
Interface
GCI, PCM, SPI
Number Of Circuits
2
Voltage - Supply
3.3V, 5V
Current - Supply
65mA
Power (watts)
941mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Includes
Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
Product
SLIC
Supply Voltage (min)
3.13 V
Supply Current
22 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Channels
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI3220-G-GQ
Manufacturer:
CREATIVE
Quantity:
99
Company:
Part Number:
SI3220-G-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
SI3220-G-GQR
Manufacturer:
SILICON
Quantity:
15 000
Company:
Part Number:
SI3220-G-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Si3220/25 Si3200/02
106
Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.3