DS3174 Maxim Integrated Products, DS3174 Datasheet - Page 219

IC QUAD DS3/E3 TXRX 400-PBGA

DS3174

Manufacturer Part Number
DS3174
Description
IC QUAD DS3/E3 TXRX 400-PBGA
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of DS3174

Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
4
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
725mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
400-BGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-

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16 PACKAGE THERMAL INFORMATION
The 36 thermal V
internal GND plane of the PC board to achieve these thermal characteristics.
Target Ambient Temperature Range
Die Junction Temperature Range
Theta-JA, Still Air
Note 1:
Theta-JA is based on the package mounted on a 4-layer JEDEC board
and measured in a JEDEC test chamber.
PARAMETER
SS
balls in the center 6X6 matrix must be thermally and electrically connected to the
12.6 °C/W (Note 1)
-40°C to +85°C
-40 to +125°C
VALUE
219

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