C2012X5R0J106M/0.85 TDK Corporation, C2012X5R0J106M/0.85 Datasheet - Page 13
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C2012X5R0J106M/0.85
Manufacturer Part Number
C2012X5R0J106M/0.85
Description
CAP CER 10UF 6.3V 20% X5R 0805
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(1 pages)
2.C2012X7R1A106K.pdf
(46 pages)
3.C2012X5R1A225M0.85.pdf
(72 pages)
Specifications of C2012X5R0J106M/0.85
Capacitance
10µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Ratings
-
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (max)
-
Thickness (max)
0.037" (0.95mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7675-2
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a
Applied for C0603, C1005, C1608, C2012, C3216
(Unit : mm)
P.C. Board for reliability test
P.C. Board for bending test
c
Solder resist
Solder resist
Applied for C0603, C1005
Copper ( thickness 0.035mm )
Solder resist
Appendix - 1a
Appendix - 2a
100
Appendix-1a, 1b, 2b
b
100
Copper
b
a
(Unit:mm)
Copper
1.6mm
—— 12 ——
0.8mm
Applied for C1608, C2012, C3216, C3225, C4532, C5750
P.C. Board for reliability test
C0603 (CC0201)
C1005 (CC0402)
C1608 (CC0603)
C2012 (CC0805)
C3216 (CC1206)
C3225 (CC1210)
C4532 (CC1812)
C5750 (CC2220)
P.C. Board for bending test
TDK (EIA style)
c
Solder resist
Applied for C3225, C4532, C5750
Slit
Appendix - 1b
Appendix - 2b
100
b
100
Solder resist
a
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
(Unit : mm)
b
Copper
(Unit : mm)
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c