C2012X5R0J106M/0.85 TDK Corporation, C2012X5R0J106M/0.85 Datasheet - Page 19
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C2012X5R0J106M/0.85
Manufacturer Part Number
C2012X5R0J106M/0.85
Description
CAP CER 10UF 6.3V 20% X5R 0805
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(1 pages)
2.C2012X7R1A106K.pdf
(46 pages)
3.C2012X5R1A225M0.85.pdf
(72 pages)
Specifications of C2012X5R0J106M/0.85
Capacitance
10µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Ratings
-
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (max)
-
Thickness (max)
0.037" (0.95mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7675-2
No.
4
Mounting
Process
4-1. Stress from mounting head
4-2. Amount of adhesive
1)
2)
3)
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
Adjust the mounting head pressure to be 1 to 3N of static weight.
To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Single sided
mounting
Double-sides
mounting
Example : C2012 (CC0805), C3216 (CC1206)
—— 18 ——
a
b
c
Solder
peeling
Not recommended
Do not touch the solder land
Crack
Condition
a
c
Crack
0.2mm min.
70 - 100μm
c
a
Support pin
Support pin
Recommended