AN610 Vishay Semiconductors, AN610 Datasheet
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AN610
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AN610 Summary of contents
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... Event recording and monitoring of solder joint resis- tances of each daisy chain joint at the end of each cycle identifies a failure point for the solder joint. The primary benchmark as per IPC-9701 failure occurs before 3,000 temperature cycles, in which case the part qualifies for solder joint reliability. AN610 Vishay Siliconix www.vishay.com 1 ...
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... AN610 Vishay Siliconix DOE PHASE (I): a) PCB design: A worst-case PCB design was se- lected for this experiment, using a FR-4 board de- signed with 16 layers and 3.175-mm [0.125-in.] thickness as per IPC-9701 guidelines. Refer to the Figure 3 for more information. The layer stack com- prised two outer copper layers of 35 µm [0.5 oz.] and 14 inner copper layers of 12 µ ...
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... Stencil printing: Machine: EKRA E5 Squeegee size / angle: 450 mm / 60° Front/rear pressure: 40 Newtons Print speed: 8-12 mm/s Snap off Separation speed: 0.5 mm/s Stencil thickness: 5 mils Stencil opening: See Table 1 below AN610 Vishay Siliconix [2] Component Aspect ratio Area ratio shape POLARPAK 5.04 2 ...
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... AN610 Vishay Siliconix Table 1 Version Comp Type Buildt Qty CA PolarPAK 2. Pick and place Machine: Juki 2060E Note: In each board, leave the first location empty (no load/part) 3. Reflow Machine: BTU Pyramax 98 (seven heating zones and two cooling zones nitrogen, air only RSS profile shown in Figure 7 was used for the lead- ...
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... Ramp 50%Bottom: 350 °CTime: 20 seconds Top: 350 °C, Flow: Reflow 50%Bottom: 350 °CTime: 30 seconds Nozzle Height 0.125 in. AN610 Profile 2 Top: 200 °C Bottom: 400 °C Time: T °C Top: 300 °C, Flow: 50% Bottom: 350 °C Time: 90 seconds Top: 350 °C, Flow: 50% Bottom: 350 ° ...
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... AN610 Vishay Siliconix Rework results: Figure 11: Smallest Void After Rework Component Type: PolarPAK Board#: 32 Location: U12 Figure 12: Largest void after rework Component Type: PolarPAK Board#: 33 Location: U13 www.vishay.com 6 Summary of complete assembly: • Solder release is consistent • The amount of voids for this package range of ...
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... PolarPAK 33 PolarPAK 33 PolarPAK 33 PolarPAK 33 n/a 33 PPAK SO8-EXT 34 PPAK SO8-EXT 34 PPAK SO8-EXT 34 PPAK SO8-EXT 34 PPAK SO8-EXT 34 PPAK SO8-EXT 34 AN610 Vishay Siliconix Terminated 3/2/2005 Fail Side ID U9 U10 U11 U12 U13 U14 U15 U16 N/A U9 U10 U11 U12 U13 U14 U15 U16 N/A ...
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... AN610 Vishay Siliconix Started 11/17/2004 Board Package PPAK SO8-EXT 34 n/a 34 PolarPAK 34 PolarPAK 34 PolarPAK 34 PolarPAK 34 PolarPAK 34 PolarPAK 34 PolarPAK 34 n/a 34 PolarPAK 35 PolarPAK 35 PolarPAK 35 PolarPAK 35 PolarPAK 35 PolarPAK 35 PolarPAK 35 n/a 35 (6) Results summary Table 5: Package First Fail # Failed PolarPAK The above results show that the PolarPAK package ...
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... Note: The smallest voids are based on signal pins. All images are captured through 5DX. No void measure- ment is available because of too many false calls on this component type. Smallest void Board#: 29 Location: U14 Largest void Board#: 29 Location: U9 Document Number 73507 31-Aug-05 Appendix A Smallest void Board#: 30 Location: U11 Largest void Board#: 30 Location: U15 AN610 Vishay Siliconix www.vishay.com 9 ...
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... AN610 Vishay Siliconix Smallest void Board#: 31 Location: U11 Largest void Board#: 31 Location: U10 www.vishay.com 10 Smallest void Board#: 32 Location: U11 Largest void Board#: 32 Location: U14 Document Number 73507 31-Aug-05 ...
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... Smallest void Board#: 33 Location: U12 Largest void Board#: 33 Location: U9 Document Number 73507 31-Aug-05 AN610 Vishay Siliconix Smallest void Board#: 34 Location: U13 Largest void Board#: 34 Location: U14 www.vishay.com 11 ...
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... AN610 Vishay Siliconix Smallest void Board#: 35 Location: U12 Largest void Board#: 35 Location: U14 www.vishay.com 12 Document Number 73507 31-Aug-05 ...
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... PCB Layout SMD125T16L_Ver C_Side A Document Number 73507 31-Aug-05 Appendix B AN610 Vishay Siliconix www.vishay.com 13 ...
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... AN610 Vishay Siliconix PCB Fabrication Material: Thickness: Number of copper layers: Nominal outer layer (top/bottom) cu thickness: 35 µm [1378 µin.] 0.5 oz. Nominal inner layer cu thickness: Nominal FR4 insulation layer thickness: Even internal layers from each side: Cu coverage on power/ground layers:70% Cu coverage on Signal trace: Min. outer layer trace width: Test pads for each daisy chain to be provided Minimum 15-mm [0 ...
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... TC1 0 °C to 100 °C tolerance +/-5 ° °C/minutes 10 minutes 10 minutes 3,000 cycles AN610 Vishay Siliconix Time Temp 100 15 100 100 45 100 50 0 www.vishay.com ...
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... AN610 Vishay Siliconix Test monitoring: Temperature chamber characterization: Component temperature to be monitored and recorded at each board location in the chamber during the initial setup. Characterization should be performed using a representative sample load, test board configuration, and fixtures. Failure definition: Event detector 1,000 W, 10 events (maximum), 1 µs duration (maximum), reports first verified as time-to-failure. ...
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... Comp Ref 0.403 U16 U15 U14 Note U13 Open No component U12 0.239 U11 0.344 U10 0.456 U9 AN610 Vishay Siliconix Package Res (Ohm) Res (Ohm) type PolarPAK 0.061 0.092 X’ (Rework) PolarPAK 0.207 0.233 X’ (Rework) PolarPAK 0.291 0.316 PolarPAK 0.393 ...