HM1-65642-9 Intersil Corporation, HM1-65642-9 Datasheet
HM1-65642-9
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HM1-65642-9 Summary of contents
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... TEMP. RANGE -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | Intersil and Design is a trademark of Intersil Corporation. HS-6664RH File Number 3197.4 8 rad(Si)/ 125 C | Copyright © ...
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Pinouts 28 LEAD CERAMIC (SBDIP) CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW A12 DQ0 12 DQ1 13 DQ2 14 GND ...
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Burn-In Circuits HS1-6664RH 28 LEAD ( PROM DIP) HS9-6664RH 28 LEAD ( PROM FLATPACK A12 DQ0 ...
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Die Characteristics DIE DIMENSIONS: 271mils x 307mils x 19mils 1mils INTERFACE MATERIALS: Glassivation: Type: SiO 2 Å Å Thickness Top Metallization: Å Å M1:6k 1k Si/Al/Cu Å Å 2k 500 TiW Å Å M2:10k 2k Si/Al/Cu Metallization Mask ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...