AM80A-300L-120F18 Astec Power, AM80A-300L-120F18 Datasheet - Page 30

• Manufacturer Part Number: AM80A-300L-120F18
• Manufacturer: Astec Power

30
Des cription
Heats ink, "80" size, vertical fin.
Heats ink, "80" size, horizontal fin
Heats ink, "80" size, vertical fin.
Heats ink, "80" size, horizontal fin
Heats ink, "80" size, vertical fin.
Heats ink, "80" size, horizontal fin
Heats ink, "80" size, low profile
Thermal Pad, "80" s ize
Mounting Kit, Tapped Studs
Mounting Kit, Solder Studs
Mounting Kit, Tapped Studs
for low profile heatsink
Mounting Kit, Solder Studs
for low profile heatsink
Spring Sockets (20 cont. 15pwr)
Heatsink Mounting Information
Heatsinks for AMPSS
of sizes and fin orientation. Mounting kits and thermal pads
are also available. The table below shows the options
available for AM80A Performance Series.
A heatsink mounting kit provides the most convenient way
to mount the heatsink to the module and then mount the
assembly onto a circuit board
To provide optimal thermal contact between heatsink and module, it is recommended that the mating surface of the
heatsink should have a surface flatness of no greater than 0.1mm. The use of a thermal pad or thermal grease is also
recommended.
Note: 1) Baseplate and heatsink must be connected to protective earth.
1
AMPSS
2) Mechanical support must not induce twist in the module baseplate and must incorporate strain relief,
e.g. spring washers.
®
Reference Manual
TM
modules are available in a variety
Model Number
APA501-80-001
APA501-80-002
APA501-80-003
APA501-80-004
APA501-80-005
APA501-80-006
APA501-80-007
APA502-80-001
APA503-00-001
APA503-00-002
APA503-00-007
APA503-00-008
APA504-00-001
AMPSS
output pins only, or may be fixed to the board th cases the
studs provide clearance between the module and the circuit
board to facilitate PCB cleaning operations.
4.53x2.32x0.6
4.53x2.32x0.6
4.53x2.32x0.9
4.53x2.32x0.9
4.53x2.32x1.5
4.53x2.32x1.5
4.55x3.50x0.5
inches
2
TM
modules may be retained by their in put and
Dimens ions
115x59x15
115x59x15
115x59x22.5
115x59x22.5
115x59x37
115x59x37
115.6x89x12
mm
Rev. 05 Mar 99
Free air thermal
res is tance
2.7°C/W
2.4°C/W
2.2°C/W
2.0°C/W
2.0°C/W
1.7°C/W
2.2°C/W