MAX3658AETA+T Maxim Integrated Products, MAX3658AETA+T Datasheet - Page 11

• Manufacturer Part Number: MAX3658AETA+T
• Description: IC AMP TRANSIMPEDANCE 8-TDFN
• Manufacturer: Maxim Integrated Products
• Type: Transimpedance Amplifierr

Specifications of MAX3658AETA+T

• Applications: Optical Networks
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 7. FILT Interface
Figure 8. MON Interface
TOP VIEW
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD
GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE.
**AGP = DEVICE TOPMARK.
FILT
MON
______________________________________________________________________________________
V
CC
V
GND
8
1
CC
(3mm x 3mm)
MAX3658
OUT-
TDFN*
IN
7
2
AGP**
V
20pF
CC
Pin Configuration
400Ω
20kΩ
OUT+
FILT
6
3
MON
GND
5
4
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
Table 2 gives center pad coordinates for the MAX3658
bond pads. Refer to application note HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size for more information on bond-pad coordinates.
Table 2. Bond-Pad Information
TRANSISTOR COUNT: 833
PROCESS: GST-4
BP10
PAD
BP1
BP2
BP3
BP4
BP5
BP6
BP7
BP8
BP9
MAX3658A
OUT+
MON
OUT-
GND
GND
N.C.
N.C.
FILT
V
IN
CC
NAME
MAX3658B
OUT+
MON
OUT-
GND
GND
N.C.
N.C.
FILT
V
IN
CC
Chip Information
Pad Coordinates
COORDINATES (µm)
445.0
456.2
455.0
455.0
254.6
135.6
16.6
18.0
18.0
16.6
X
818.6
543.4
425.8
155.6
565.8
818.6
818.6
818.6
39.4
39.4
Y
11