AD811AN Analog Devices Inc, AD811AN Datasheet - Page 20
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AD811AN
Manufacturer Part Number
AD811AN
Description
IC CURR-FDBK AMP VIDEO HS 8-DIP
Manufacturer
Analog Devices Inc
Datasheet
1.AD811ANZ.pdf
(20 pages)
Specifications of AD811AN
Slew Rate
2500 V/µs
Mounting Type
Through Hole
Rohs Status
RoHS non-compliant
Applications
Current Feedback
Number Of Circuits
1
-3db Bandwidth
140MHz
Current - Supply
16.5mA
Current - Output / Channel
100mA
Voltage - Supply, Single/dual (±)
±4.5 V ~ 18 V
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Amplifiers
1
Bandwidth
140MHz
No. Of Pins
8
Settling Time
65ns
Temperature Min
-40°C
Operating Temperature Max
85°C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD811AN
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD811ANZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD811
ORDERING GUIDE
Model
AD811AN
AD811ANZ
AD811AR-16
AD811AR-16-REEL
AD811AR-16-REEL7
AD811AR-20
AD811AR-20-REEL
AD811JR
AD811JR-REEL
AD811JR-REEL7
AD811JRZ
AD811SQ/883B
5962-9313101MPA
AD811SE/883B
5962-9313101M2A
AD811ACHIPS
AD811SCHIPS
1
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
Z = Pb-free part.
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−40°C to +85°C
−55°C to +125°C
C00866–0–7/04(E)
Package Description
8-Lead Plastic Dual In-Line Package (PDIP)
8-Lead Plastic Dual In-Line Package (PDIP)
16-LeadStandard Small Outline Package (SOIC)
16-LeadStandard Small Outline Package (SOIC)
16-LeadStandard Small Outline Package (SOIC)
20-LeadStandard Small Outline Package (SOIC)
20-LeadStandard Small Outline Package (SOIC)
8-LeadStandard Small Outline Package (SOIC)
8-LeadStandard Small Outline Package (SOIC)
8-LeadStandard Small Outline Package (SOIC)
8-LeadStandard Small Outline Package (SOIC)
8-Lead Ceramic Dual In-Line Package (CERDIP)
8-Lead Ceramic Dual In-Line Package (CERDIP)
20-Terminal Ceramic Leadless Chip Carrier (LCC)
20-Terminal Ceramic Leadless Chip Carrier (LCC)
Rev. E | Page 20 of 20
Package Option
N-8
N-8
R-16
R-16
R-16
R-20
R-20
R-8
R-8
R-8
R-8
Q-8
Q-8
E-20A
E-20A
DIE
DIE