145169-4 TE Connectivity, 145169-4 Datasheet - Page 2
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145169-4
Manufacturer Part Number
145169-4
Description
Manufacturer
TE Connectivity
Specifications of 145169-4
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Through Hole
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
5
Termination Post Length (mm [in])
2.54 [0.100]
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
3
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Housing Color
White
Housing Material
Thermoplastic - GF
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
3.4.
3.5.
Exam ination of product.
Term ination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Vibration, random .
Physical shock.
Durability.
Mating force.
Rev D
Perform ance and Test Description
Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. Unless otherwise specified, all tests shall be perform ed at am bient environm ental
conditions per Test Specification 109-1.
Test Requirem ents and Procedures Sum m ary
Test Description
20 m illiohm s m axim um initial.
Meets requirem ents of product
drawing and Application
Specifications 114-13148 and 114-
26012.
ÄR 10 m illiohm s m axim um final.
1000 m egohm s m inim um .
500 volts AC at sea level.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
See Note.
8 ounces m axim um per contact
pair.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirem ent
TE Spec 109-28-4.
TE Spec 109-29-1.
Visual, dim ensional and functional
per applicable quality inspection
plan.
TE 109-6-1.
Subject m ated contacts assem bled
in housing to 50 m v m axim um open
circuit at 100 m a m axim um .
See Figure 4.
Test between adjacent contacts of
unm ated sam ples.
Test between adjacent contacts of
unm ated sam ples.
TE Spec 109-21-7, Condition A.
Subject m ated sam ples to 5 to 500
Hz. Fifteen m inutes in each of 3
m utually perpendicular planes.
TE Spec 109-26-9.
Subject m ated sam ples to 100 G's
sawtooth shock pulses of 6
m illiseconds duration. Three shocks
in each direction applied along 3
m utually perpendicular planes, 18
total shocks.
TE Spec 109-27.
Mate and unm ate sam ples for 100
cycles at m axim um rate of 500
cycles per hour.
TE Spec 109-35.
Measure force necessary to m ate
printed circuit board to sam ples
using free floating fixtures at
m axim um rate of .5 inch per m inute.
Procedure
108-14034
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