145169-4 TE Connectivity, 145169-4 Datasheet - Page 3
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145169-4
Manufacturer Part Number
145169-4
Description
Manufacturer
TE Connectivity
Specifications of 145169-4
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Through Hole
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
5
Termination Post Length (mm [in])
2.54 [0.100]
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
3
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Housing Color
White
Housing Material
Thermoplastic - GF
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Unm ating force.
Therm al shock.
Hum idity/tem perature cycling.
Tem perature life.
Mixed flowing gas.
Rev D
NOTE
Test Description
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
0.5 ounce m inim um per contact
pair.
See Note.
See Note.
See Note.
See Note.
ENVIRONMENTAL
Figure 1 (end)
Requirem ent
TE Spec 109-35.
Measure force necessary to unm ate
printed circuit board from sam ples
at m axim um rate of .5 inch per
m inute.
TE Spec 109-22.
Subject unm ated sam ples to 5
cycles between -55 and 85°C.
TE Spec 109-23-3, Condition B.
Subject unm ated sam ples to 10
cycles between 25 and 65°C at 95%
RH.
TE Spec 109-43.
Subject m ated sam ples to
tem perature life at 85°C for 1000
hours.
TE Spec 109-85-2.
Subject m ated sam ples to
environm ental class II for 14 days.
Procedure
108-14034
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