ADD8704ACPZ-R2 Analog Devices Inc, ADD8704ACPZ-R2 Datasheet - Page 5
![IC OPAMP LCD QUAD 16V 16LFCSP](/photos/6/50/65061/505-16-lfcsp_sml.jpg)
ADD8704ACPZ-R2
Manufacturer Part Number
ADD8704ACPZ-R2
Description
IC OPAMP LCD QUAD 16V 16LFCSP
Manufacturer
Analog Devices Inc
Datasheet
1.ADD8704ACPZ-R2.pdf
(16 pages)
Specifications of ADD8704ACPZ-R2
Applications
TFT-LCD Panels: Gamma Buffer, VCOM Driver
Number Of Circuits
4
-3db Bandwidth
6.8MHz
Slew Rate
6 V/µs
Current - Supply
2.8mA
Current - Output / Channel
35mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 16 V
Mounting Type
Surface Mount
Package / Case
16-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
Table 3. ADD8704 Stress Ratings
Parameter
Supply Voltage (V
Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range
ESD Tolerance (HBM)
ESD Tolerance (MM)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this part features proprietary
ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
S
)
1
Rating
18 V
–0.5 V to V
V
–65°C to +150°C
–40°C to +85°C
–65°C to +150°C
300°C
±1500 V
175 V
S
S
+ 0.5 V
Rev. 0 | Page 5 of 16
Table 4. Package Characteristics
Package Type
14-Lead TSSOP (RU)
16-Lead LFCSP (CP)
1
2
3
Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
θ
soldered onto a circuit board for surface-mount packages.
DAP is soldered down to PCB.
JA
is specified for worst-case conditions, i.e., θ
θ
180
38
JA
3
2
JA
is specified for devices
θ
35
30
JC
3
ADD8704
Unit
°C/W
°C/W