EL5329IRZ-T7 Intersil, EL5329IRZ-T7 Datasheet - Page 11

• Manufacturer Part Number: EL5329IRZ-T7
• Description: IC BUFFER MULTI-CHANNEL 28-TSSOP
• Manufacturer: Intersil

Specifications of EL5329IRZ-T7

• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Output Type: Rail-to-Rail
• Number Of Circuits: 11
• -3db Bandwidth: 10MHz
• Slew Rate: 9 V/µs
• Current - Supply: 5.5mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

EL5129, EL5329
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
- pin is
S
connected to ground, one 0.1µF ceramic capacitor should be
placed from the V
+ pin to ground. A 4.7µF tantalum
S
capacitor should then be connected from the V
+ pin to
S
ground. One 4.7µF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (V
-). If V
- is tied to ground, the
S
S
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
11
FN7430.1
May 13, 2005