EL5824IRE Intersil, EL5824IRE Datasheet - Page 10

• Manufacturer Part Number: EL5824IRE
• Description: IC BUFFER 10XGAMMA 9.5MA 28HTSSO
• Manufacturer: Intersil

Specifications of EL5824IRE

• Applications: TFT-LCD Panels: Gamma Buffer, VCOM Driver
• Output Type: Rail-to-Rail
• Number Of Circuits: 10
• -3db Bandwidth: 12MHz
• Slew Rate: 15 V/µs
• Current - Supply: 9.5mA
• Current - Output / Channel: 140mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 16.5 V, ±2.25 V ~ 8.25 V
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

will limit the short circuit current to ±200mA if the outputs are
directly shorted to the positive or the negative supply. If the
output is shorted indefinitely, the power dissipation could
easily increase such that the part will be destroyed.
Maximum reliability is maintained if the output continuous
current never exceeds ±30mA for the buffers and ±60mA for
the V
internal metal interconnections.
The Unused Buffers
It is recommended that any unused buffers should have their
inputs tied to ground plane.
Power Dissipation
With the high-output drive capability of the EL5524, EL5624,
EL5724, and EL5824, it is possible to exceed the 125°C
“absolute-maximum junction temperature” under certain load
current conditions. Therefore, it is important to calculate the
maximum junction temperature for the application to
determine if load conditions need to be modified for the
buffer to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
where:
• T
• T
• θ
• P
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
when sourcing, and:
P
(
when sinking.
P
P
(
V
V
DMAX
DMAX
DMAX
OUT
S
AMAX
JA
JMAX
+
DMAX
COM
–
= Thermal resistance of the package
–
V
=
=
=
OUT
V
= Maximum junction temperature
= Maximum ambient temperature
S
V
V
T
-------------------------------------------- -
= Maximum power dissipation in the package
amplifier. These limits are set by the design of the
- )
S
JMAX
S
)
×
×
×
×
I
I
I
S
I
S
LA
Θ
LA
+
+
- T
JA
Σi
Σi
AMAX
×
×
( [
[
(
V
V
S
OUT
+
10
–
i
V
–
OUT
V
S
- )
i )
×
×
I
I
LOAD
LOAD
EL5524, EL5624, EL5724, EL5824
i ]
i ]
+
+
where:
• i = 1 to total number of buffers
• V
• I
• V
• V
• I
• I
If we set the two P
can solve for the R
package power dissipation curves provide a convenient way
to see if the device will overheat. The maximum safe power
dissipation can be found graphically, based on the package
type and the ambient temperature. By using the previous
equation, it is a simple matter to see if P
device's power derating curves.
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
connected to ground, one 0.1µF ceramic capacitor should be
placed from the V
capacitor should then be connected from the V
ground. One 4.7µF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (V
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
SMAX
LOAD
LA
S
OUT
OUT
= Total supply voltage of buffer and V
= Load current of V
i = Maximum output voltage of the application
i = Load current of buffer
= Maximum output voltage of V
= Total quiescent current
S
DMAX
LOAD
+ pin to ground. A 4.7µF tantalum
S
-). If V
's to avoid device overheat. The
equations equal to each other, we
COM
S
- is tied to ground, the
COM
DMAX
COM
S
- pin is
exceeds the
S
+ pin to