BYW29ED-200 NXP Semiconductors, BYW29ED-200 Datasheet

Ultrafast power diode in a SOT428 (DPAK) surface-mountable package

BYW29ED-200

Manufacturer Part Number
BYW29ED-200
Description
Ultrafast power diode in a SOT428 (DPAK) surface-mountable package
Manufacturer
NXP Semiconductors
Datasheet

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BYW29ED-200
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NXP
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DISCRETE SEMICONDUCTORS
DATA SHEET
BYW29EB, BYW29ED series
Rectifier diodes
ultrafast, rugged
Product specification
November 1998

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BYW29ED-200 Summary of contents

Page 1

... DATA SHEET BYW29EB, BYW29ED series Rectifier diodes ultrafast, rugged Product specification DISCRETE SEMICONDUCTORS November 1998 ...

Page 2

... Low thermal resistance GENERAL DESCRIPTION Ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. The BYW29EB series is supplied in the SOT404 surface mounting package. The BYW29ED series is supplied in the SOT428 surface mounting package. PINNING PIN DESCRIPTION ...

Page 3

... Reverse recovered charge rr t Reverse recovery time rr1 t Reverse recovery time rr2 V Forward recovery voltage fr November 1998 BYW29EB, BYW29ED series CONDITIONS Human body model 250 pF 1.5 kΩ CONDITIONS SOT404 and SOT428 packages, pcb mounted, minimum footprint, FR4 board CONDITIONS 150˚C F ...

Page 4

... 0.791 0.013 Ohms 7 6 D.U. ’scope Fig.6. Maximum forward dissipation P rr2 sinusoidal current waveform where a = form 3 Product specification BYW29EB, BYW29ED series I = 0.25A rec trr2 Fig.4. Definition of t rr2 BYW29 Tmb(max 1.0 0.5 0.2 0 ...

Page 5

... November 1998 100 10 1.0 100 = 25 ˚ IF=1A 0.1 0.01 0.001 100 = 25 ˚C. Fig.11. Transient thermal impedance BYW29 max 1 Product specification BYW29EB, BYW29ED series IF=10A 1.0 10 -dIF/dt (A/us) Fig.10. Maximum ˚ Transient thermal impedance, Zth j-mb (K/ 1us ...

Page 6

... Net Mass: 1.4 g 2.54 (x2) MOUNTING INSTRUCTIONS Dimensions in mm Notes 1. Epoxy meets UL94 V0 at 1/8". November 1998 10.3 max 11 max 15.4 0.85 max (x2) Fig.12. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.13. SOT404 : soldering pattern for surface mounting . 5 Product specification BYW29EB, BYW29ED series 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.300 ...

Page 7

... Notes 1. Plastic meets UL94 V0 at 1/8". November 1998 1.1 2.38 max 6.73 max 0.93 max tab 6.22 max 10.4 max 2 0.5 min 3 1 0.8 max (x2) Fig.14. SOT428 : centre pin connected to tab. 7.0 2.15 2.5 4.57 Fig.15. SOT428 : minimum pad sizes for surface mounting . 6 Product specification BYW29EB, BYW29ED series seating plane 5.4 4 min 4.6 0.5 0.3 0.5 7.0 1.5 Rev 1.300 ...

Page 8

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...

Page 9

... Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www ...

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