MCP6541T-I/OT Microchip Technology, MCP6541T-I/OT Datasheet - Page 24

IC COMP PUSHPLL 1.6V SNGL SOT235

MCP6541T-I/OT

Manufacturer Part Number
MCP6541T-I/OT
Description
IC COMP PUSHPLL 1.6V SNGL SOT235
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6541T-I/OT

Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
SC-74A, SOT-753
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
1 Channel
Product
Analog Comparators
Response Time
4 us
Offset Voltage (max)
5 mV
Input Bias Current (max)
1 pA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Supply Current (max)
1 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Comparator Type
Micropower
No. Of Comparators
1
Ic Output Type
CMOS, Push Pull, TTL
Supply Current
600nA
Supply Voltage Range
1.6V To 5.5V
Amplifier Case Style
SOT-23
Rohs Compliant
Yes
Output Compatibility
CMOS, TTL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6541T-I/OT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP6541T-I/OT
0
Company:
Part Number:
MCP6541T-I/OT
Quantity:
6 000
MCP6541/1R/1U/2/3/4
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21696F-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A2
A1
E1
L1
N
A
E
D
e
h
L
c
b
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
c

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