BAT30F3 STMicroelectronics, BAT30F3 Datasheet - Page 6

• Manufacturer Part Number: BAT30F3
• Description: Schottky Barrier, Signal Schottky
• Manufacturer: STMicroelectronics

PCB recommendations
4
4.1
Note:
6/10
Figure 9.
PCB recommendations
Design
For optimum electrical performance and highly reliable solder joints, STMicroelectronics
recommends the PCB design recommendations listed in
Table 3.
A gold layer finishing on the PCB pad that is too thick (0.2 µm maximum) is not
recommended (low joint reliability).
For NSMD PCB
non solder mask defined
For SMD PCB
solder mask defined
PCB Pad Finishing
All dimensions in mm
Flip Chip tape and reel specification (dimensions in mm)
PCB design recommendations for solder bar pitch 400 µm
0.20 ± 0.05
0.43 ± 0.1
Oblong pad: 370 x 180 µm
– Micro via SSBU allowed
– Micro via SBU to be avoided
– Micro via SBU filled (under qualification)
Track:
– Only one track per pad
– Maximum track width = 100 µm
Track layout must be symmetrical to the die axis (to homogenize stress
and welding attraction during reflow assembly)
Oblong pad:
– Micro via SSBU allowed
– Micro via SBU to be avoided
– Micro via SBU filled (under qualification)
Cu – Ni (2-6 µm) - Au (0.2 µm max)
Doc ID 16915 Rev 2
2.0 ± 0.05
0.57 ± 0.05
User direction of unreeling
4.0 ± 0.1
Table
2.0 ± 0.1
3.
Ø 1.55 ± 0.05
BAT30F3