STM8L151G4 STMicroelectronics, STM8L151G4 Datasheet - Page 116
STM8L151G4
Manufacturer Part Number
STM8L151G4
Description
8-bit ultra-low-power MCU, up to 32 KB Flash, 1 KB Data EEPROM
Manufacturer
STMicroelectronics
Datasheet
1.STM8L151G4.pdf
(126 pages)
Specifications of STM8L151G4
Temp. Range
- 40 °C to 85, 105 or 125 °C
5 Low Power Modes
Wait, Low power run (5.1 μA), Low power wait (3 μA), Active-halt with full RTC (1.3 μA), Halt (350 nA)
Consumption
195 μA/MHz+440μA
Ultralow Leakage Per I/0
50 nA
Fast Wakeup From Halt
4.7 μs
Lcd
up to 4x28 segments w/ step-up converter
4 Channels; Supported Peripherals
ADC, DAC, SPI, I2C, USART, timers
2 Watchdogs
1 Window, 1 Independent
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Package characteristics
10.2.4
116/126
32-lead ultra thin fine pitch quad flat no-lead 5x5 mm package
(UFQFPN32)
Figure 47. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
4. Dimensions are in millimeters.
solder this back-side pad to PCB ground.
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
b
8
1
32
9
Doc ID 15962 Rev 9
e
Bottom view
D2
D
16
L
17
24
L
A1
E
STM8L151xx, STM8L152xx
A
ddd C
A0B8_ME