STM8L101K3 STMicroelectronics, STM8L101K3 Datasheet - Page 67

• Manufacturer Part Number: STM8L101K3
• Description: Ultra Low Power MCUs, STM8L
• Manufacturer: STMicroelectronics

Specifications of STM8L101K3

• Low Power Consumption (halt: 0.3 μA, Active-halt
• Temp. Range: -40 to 85 °C and 125 °C
• Three Low Power Modes: Wait, Active-halt, Halt

1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
STM8L101xx
10.2
Table 39.
Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
D2
A1
A3
E2
A
D
E
b
e
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
Package mechanical data
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
quad flat no-lead package outline
(5 x 5)
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
mm
Typ
17
24
L
A1
E
A
Doc ID 15275 Rev 11
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.6
Figure 38. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
Min
0
footprint
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
Package characteristics
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
Max
67/81