STM8L152M8 STMicroelectronics, STM8L152M8 Datasheet - Page 123
STM8L152M8
Manufacturer Part Number
STM8L152M8
Description
STM8L-Ultra Low Power-8 bits Microcontrollers
Manufacturer
STMicroelectronics
Datasheet
1.STM8L151R6.pdf
(126 pages)
Specifications of STM8L152M8
Operating Power Supply
1.65 to 3.6 V (without BOR), 1.8 to 3.6 V (with BOR)
Temp. Range
−40 to 85, 105 or 125 °C
5 Low Power Modes
Wait, Low power run (5.9 μA), Low power wait (3 μA), Active-halt with full RTC (1.4 μA), Halt (400 nA)
Dynamic Power Consumption
200 μA/MHz+330 μA
Ultra Low Leakage Per I/0
50 nA
Max Freq
16 MHz, 16 CISC MIPS peak
Lcd
8x40 or 4x44 w/ step-up converter
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STM8L15xx8, STM8L15xR6
Table 65.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 51. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
Symbol
back-side pad to PCB ground.
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
outline
0.550
0.020
0.530
0.150
0.230
7.000
4.700
7.000
4.700
0.500
0.400
Typ
(1)(2)(3)
millimeters
0.500
0.500
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.140
0.080
Min
0
Doc ID 17943 Rev 4
0.600
0.050
0.550
0.160
0.300
7.150
5.250
7.150
5.250
0.550
0.500
Max
Figure 52. Recommended footprint
0.02170
0.0008
0.0209
0.0059
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
7.30
Typ
0.30
0.55
0.20
12
1
48
13
(dimensions in mm)
inches
6.20
0.01970
0.0197
0.0055
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
0.0031
Package characteristics
Min
0
7.30
5.60
5.80
6.20
(1)
5.60
0.50
37
24
0.0236
0.0020
0.0217
0.0063
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
36
25
Max
(1)
0.75
123/126
5.80
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