AP72T02GJ-HF Advanced Power Electronics Corp., AP72T02GJ-HF Datasheet - Page 2

The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,ruggedized device design, low on-resistance and cost-effectiveness

AP72T02GJ-HF

Manufacturer Part Number
AP72T02GJ-HF
Description
The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching,ruggedized device design, low on-resistance and cost-effectiveness
Manufacturer
Advanced Power Electronics Corp.
Datasheet

Specifications of AP72T02GJ-HF

Vds
25V
Vgs
±20V
Rds(on) / Max(m?) Vgs@10v
9
Rds(on) / Max(m?) Vgs@4.5v
15
Qg (nc)
13
Qgs (nc)
2.7
Qgd (nc)
9
Id(a)
62
Pd(w)
60
Configuration
Single N
Package
TO-251
ΔBV
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
BV
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
R
V
t
Q
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
3.Starting T
4.Surface mounted on 1 in
AP72T02GH/J-HF
Electrical Characteristics@T
Source-Drain Diode
DSS
GSS
d(on)
r
d(off)
f
rr
fs
GS(th)
SD
DS(ON)
iss
oss
rss
g
g
gs
gd
rr
DSS
Symbol
Symbol
DSS
/ΔT
j
j
=25
o
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Static Drain-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Drain-Source Leakage Current (T
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
C , V
DD
=25V , L=0.1mH , R
2
copper pad of FR4 board
Parameter
Parameter
2
2
2
2
j
=25
G
=25Ω , I
j
=125
o
C(unless otherwise specified)
2
o
C)
AS
V
Reference to 25℃, I
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
f=1.0MHz
f=1.0MHz
I
I
dI/dt=100A/µs
=24A.
D
D
S
S
GS
GS
GS
DS
DS
DS
DS
GS
DS
GS
DS
GS
DS
G
D
=30A, V
=15A, V
=30A
=30A
=0.5Ω
=3.3Ω,V
=V
=10V, I
=25V, V
=20V ,V
=20V
=15V
=25V
=0V, I
=10V, I
=4.5V, I
= +20V, V
=4.5V
=0V
GS
Test Conditions
Test Conditions
, I
D
GS
GS
D
=250uA
D
D
D
=250uA
GS
GS
GS
=30A
=0V
=0V,
=30A
=15A
DS
=10V
=0V
=0V
=0V
D
=1mA
Min.
Min.
25
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.02
Typ.
Typ.
930
250
180
2.7
1.1
11
42
13
80
22
26
15
8
9
8
6
-
-
-
-
-
-
+100
Max. Units
1490
Max. Units
250
1.7
1.3
15
21
9
3
1
-
-
-
-
-
-
-
-
-
-
-
-
-
V/℃
mΩ
mΩ
nC
nC
nC
nC
uA
uA
nA
pF
pF
pF
ns
ns
ns
ns
ns
V
V
S
V
2

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