MC74VHC1G50DFT2G ON Semiconductor, MC74VHC1G50DFT2G Datasheet - Page 8

• Manufacturer Part Number: MC74VHC1G50DFT2G
• Description: IC BUFFER CMOS NON-INV SOT353
• Manufacturer: ON Semiconductor
• Series: 74VHCr

Specifications of MC74VHC1G50DFT2G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Logic Family: VHC
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 1 / 1
• Propagation Delay Time: 10.6 ns at 3.3 V, 7.5 ns at 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74VHC1G50DFT2GOS; MC74VHC1G50DFT2GOS; MC74VHC1G50DFT2GOSTR

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0.05 (0.002)
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
S
H
1
D
5
L
A
2
G
*For additional information on our Pb--Free strategy and soldering
4
3
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Figure 12.
B
C
0.039
1.0
0.037
0.95
N. American Technical Support: 800--282--9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2--9--1 Kamimeguro, Meguro--ku, Tokyo, Japan 153--0051
Phone: [phone]
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
SOT23- -5/TSOP- -5/SC59- -5
THIN SOT23- -5/TSOP- -5/SC59- -5
5--LEAD PACKAGE
http://onsemi.com
CASE 483--01
K
DT SUFFIX
ISSUE C
0.074
1.9
0.028
8
J
0.7
M
SCALE 10:1
0.094
2.4
NOTES:

1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. A AND B DIMENSIONS DO NOT INCLUDE
inches
mm
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
G
M
A
B
C
D
H
K
L
S
J

0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
0
_
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.100 0.0005 0.0040
MAX
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
10
3.00 0.0985 0.1181
_
MIN
0
INCHES
_
MAX
MC74VHC1G50/D
10
_