SLE 5518 Infineon Technologies, SLE 5518 Datasheet
SLE 5518
Specifications of SLE 5518
Related parts for SLE 5518
SLE 5518 Summary of contents
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... Chip Card & Security ICs SLE 5518 Intelligent 1024 Byte EEPROM with Write Protection Short Product Information May 2007 ...
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... SLE 5518 Short Product Information Revision History: Current Version 2007-05-03 Previous Releases: 2006-11-24 Page Subjects (changes since last revision) Preliminary removed, editorial updates Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security ICs, Fax +49 (0)89 / 234-955 9372 E-Mail: security ...
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... Data retention for minimum of 10 years • Advanced CMOS-technology optimized for security layout – EEPROM-cells protected by shield – Shielding of deeper layers via metal – Sensory- and logical security functions – No insulation of backside necessary 1 ) Values are temperature dependent. Short Product Information SLE 5518 2007-05-03 ...
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... Type Package SLE 5518 C Die (on Wafer) SLE 5518 D Die (on Wafer) SLE 5518 M3 T-M3.2-6 SLE 5518 MFC3 S-MFC3.1-6-1 Pin Description Figure 1 Pin Configuration Wire-bonded Module M3.2 (top view) Figure 2 Pin Configuration Module Flip Chip MFC3.1 (top view) 1) Available as a Module Flip Chip (MFC3), wire-bonded module (M2 and M3) for embedding in plastic cards die ...
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... Pad Configuration Die Table 2 Pin Definitions and Functions M3 / MFC3 Card Contact Symbol C1 VCC C2 RST C3 CLK C5 GND C6 N.C. C7 I/O Short Product Information SLE 5518 Function Supply voltage Reset (Chip Enable) Clock input Ground Not connected Bi-directional data line (open drain SLE 5518 GND I/O 2007-05-03 ...
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... Write Protection Memory. Dependent on the state of the protection bit the Data Memory is read only (ROM) or may be erased and written again (EEPROM). The manufacturer code (Application ID and Chip Coding) is programmed unalterable by the chip manufacturer. Figure 2 Memory Configuration SLE 5518 Short Product Information SLE 5518 2007-05-03 ...