SLE 5518 Infineon Technologies, SLE 5518 Datasheet - Page 4

• Manufacturer Part Number: SLE 5518
• Manufacturer: Infineon Technologies

Specifications of SLE 5518

• Product Description: Intelligent 1024 Byte EEPROM with Write Protection Function
• Prom: 1024-bit
• Eeprom: 1,024.0 Byte
• Delivery Forms: Module M3.2, M4.8, MFC 3.1 (FCOS™), die
• Typical Application: Healthcare and Health Insurance Card, Electronic Ticketing, Loyalty Card, Access Control

1
Table 1
Type
SLE 5518 C
SLE 5518 D
SLE 5518 M3
SLE 5518 MFC3
Pin Description
Figure 1
Figure 2
1)
Short Product Information
on non-sawn (C) / sawn wafer (D) for customer packaging
Available as a Module Flip Chip (MFC3), wire-bonded module (M2 and M3) for embedding in plastic cards or as a die
Ordering and Packaging information
Pin Configuration Wire-bonded Module M3.2 (top view)
Pin Configuration Module Flip Chip MFC3.1 (top view)
Ordering Information
Package
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
S-MFC3.1-6-1
1)
4 / 6
Remark
not sawn
Sawn
FCoS™
Ordering Code
on request
on request
on request
on request
SLE 5518
2007-05-03