NCSL219A-H3 Nichia, NCSL219A-H3 Datasheet - Page 17

• Manufacturer Part Number: NCSL219A-H3
• Manufacturer: Nichia

Specifications of NCSL219A-H3

• Size Lxwxh (mm): 3.5x3.5x2.0
• Lumi-nous Inten-sity Typ(cd): 36
• Lumi-nous Flux Typ(lm)): 108.0
• Ra Min: 80
• Forward Voltage Vf(v) Typ: 3.30
• Forward Voltage Vf(v) Max: 3.80
• Directivity (degree): 120
• If (ma): 350
• Mounting Style: Through Hole

(4) Design Consideration
(5) Electrostatic Discharge (ESD)
(6) Thermal Management
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not with hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
● ESD-damaged LEDs may have a current flow at low voltage, or no longer light up at low current.
● Thermal management is an important factor when designing your product by using the LEDs.
● Drive current should be determined for the surrounding ambient temperature (T
● The following equations can be used to calculate the junction temperature of the products.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
Thermal stress during use can cause the solder joints to crack.
or reduce its reliability performance. When handling the products, measures against electro static discharge,
including the followings, are strongly recommended.
Also note that surge protection should be considered in the design of customer products.
including the followings, are strongly recommended.
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement or light up test
at low current. (the recommended current is 1mA or lower)
The rise in LED die temperature can be affected by PCB thermal resistance or/and LED spacing as mounted on the board.
Customer is advised to design the product to ensure that the LED die temperature
does not exceed the required maximum Junction Temperature (T
1) T
Ts Point
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
Failure Criteria: V
*T
T
T
R
R
W=Input power(I
J
=T
A
S
θJA
θJS
J
=LED junction temperature: °C
=Ambient temperature: °C
=Soldering temperature (cathode side): °C
A
=Thermal resistance from junction to ambient: °C/W
+R
= Thermal resistance from junction to T
θJA
･ W
F
<2.0V at I
F
×V
2) T
F
): W
J
=T
F
S
=0.5mA
+R
θJS
･ W
S
measuring point: °C/W
J
).
A
) to dissipate the heat from the product.
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