NCSL219A-H3 Nichia, NCSL219A-H3 Datasheet - Page 6

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NCSL219A-H3

Manufacturer Part Number
NCSL219A-H3
Description
Manufacturer
Nichia
Datasheet

Specifications of NCSL219A-H3

Size Lxwxh (mm)
3.5x3.5x2.0
Lumi-nous Inten-sity Typ(cd)
36
Lumi-nous Flux Typ(lm))
108.0
Ra Min
80
Forward Voltage Vf(v) Typ
3.30
Forward Voltage Vf(v) Max
3.80
Directivity (degree)
120
If (ma)
350
Mounting Style
Through Hole
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
● Recommended Soldering Pad Pattern
* The product is designed to be reflow soldered to a PCB. If you use dip soldering or manual soldering for the products,
* Reflow soldering must not be performed more than twice.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* The Die Heat Sink should be soldered to customer PCB.
* When soldering, avoid applying any stress to the LED package while heated.
Nichia cannot guarantee its reliability.
due to the heat and atmosphere of reflow soldering.
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, bump breakage
and an adverse effect on product reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
If it is difficult or impossible, use high heat-dissipating adhesive.
1 to 5°C per sec
0.4
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
Pre-heat
180 to 200°C
120sec Max
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to bump damage or breakage.
0.5
3.8
3
0.5
60sec Max
Above 220°C
1.3
4.1
(単位 Unit: mm)
260°C Max
10sec Max
(単位 Unit: mm)
5

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