MSK0002ERH M.S. Kennedy Corp., MSK0002ERH Datasheet - Page 3

• Manufacturer Part Number: MSK0002ERH
• Description: RAD TOLERANT, HIGH SPEED, BUFFER AMPLIFIER
• Manufacturer: M.S. Kennedy Corp.

Where
HEAT SINKING
Thermal Model:
Governing Equation:
Example:
This example demonstrates a worst case analysis for the buffer
output stage. This occurs when the output voltage is 1/2 the
power supply voltage. Under this condition, maximum power
transfer occurs and the output is under maximum stress.
Conditions:
For a worst case analysis we will treat the ±6Vp sine wave as
an 6 VDC output voltage.
1.) Find Driver Power Dissipation
2.) For conservative design, set T
3.) For this example, worst case T
4.) R
5.) R
6.) Rearrange governing equation to solve for R
and if so, what type, refer to the thermal model and governing
equation below.
VCC= ±12VDC
Vo= ±6Vp Sine Wave, Freq. = 1KHz
RL= 100
T
T
PD=Total Power Dissipation
R
R
T
T
T
To determine if a heat sink is necessary for your application
C
A
S
J=
J
PD= (Vcc-Vo) (Vo/R
=Junction Temperature
=Sink Temperature
=Case Temperature
=Ambient Temperature
JC
CS
P
JC
CS
APPLICATION NOTES
=Junction to Case Thermal Resistance
=Heat Sink to Ambient Thermal Resistance
= 360mW
= (12V-6V) (6V/100 )
D X
= 55° C/W from MSK 0002RH Data Sheet
= 0.15° C/W for most thermal greases
(R
JC
+R
CS +
R
L
)
SA
) +T
A
J
A
=+125°C Max.
=+80°C
SA
3
R
This heat sink in this example must have a thermal resistance
of no more than 69.9°C/W to maintain a junction temperature
of no more than +125°C.
Typical Applications:
SA
= ((125°C - 80°C) / 0.36W) - 55°C/W - 0.15°C/W
= 125 - 55.15
= 69.9°C/W
= ((T
J
- T
A
)/P
D
) - (R
JC
) - (R
CS
)
Rev. A 4/07