HFA3096 Intersil Corporation, HFA3096 Datasheet - Page 11

• Manufacturer Part Number: HFA3096
• Description: Ultra High Frequency Transistor Arrays
• Manufacturer: Intersil Corporation

Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
11
H
A1
α
0.10(0.004)
0.25(0.010)
HFA3046, HFA3096, HFA3127, HFA3128
M
L
h x 45
B
M
o
C
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AB ISSUE C)
0.0532
0.0040
0.013
0.0075
0.3367
0.1497
0.2284
0.0099
0.016
MIN
0°
0.050 BSC
INCHES
14
0.0688
0.0098
0.020
0.0098
0.3444
0.1574
0.2440
0.0196
0.050
MAX
8°
MILLIMETERS
1.35
0.10
0.33
0.19
8.55
3.80
5.80
0.25
0.40
MIN
0°
1.27 BSC
14
MAX
1.75
0.25
0.51
0.25
8.75
4.00
6.20
0.50
1.27
8°
December 21, 2005
Rev. 0 12/93
NOTES
FN3076.13
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