HVL399CM Renesas Electronics Corporation., HVL399CM Datasheet

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HVL399CM

Manufacturer Part Number
HVL399CM
Description
Variable Capacitance Diode For Vco
Manufacturer
Renesas Electronics Corporation.
Datasheet
HVL399CM
Variable Capacitance Diode for VCO
Features
Ordering Information
Type No.
HVL399CM
Pin Arrangement
Rev.1.00, Apr 13, 2004, page 1 of 4
High capacitance ratio. (n = 2.30 min)
Low series resistance. (rs = 0.4
Thin Extremely small Flat Package (TEFP) is suitable for surface mount design.
max)
Laser Mark
6
1
Cathode mark
Mark
2
1. Cathode
2. Anode
Package Code
TEFP
REJ03G0230-0100Z
Apr 13, 2004
Rev.1.00

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HVL399CM Summary of contents

Page 1

... Variable Capacitance Diode for VCO Features High capacitance ratio 2.30 min) Low series resistance. (rs = 0.4 Thin Extremely small Flat Package (TEFP) is suitable for surface mount design. Ordering Information Type No. HVL399CM Pin Arrangement Rev.1.00, Apr 13, 2004, page max) Laser Mark 6 Cathode mark Mark • ...

Page 2

... HVL399CM Absolute Maximum Ratings Item Reverse voltage Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current Capacitance C 0.5 C 2.5 Capacitance ratio n Series resistance r s Notes 1. Please do not use the soldering iron due to avoid high stress to the TEFP package. 2. The material of lead is exposed for cutting plane. Therefore, soldering nature of lead tip part is considered as unquestioned ...

Page 3

... HVL399CM Main Characteristic –9 10 –10 10 –11 10 –12 10 – Reverse voltage V Fig.1 Reverse current vs. Reverse voltage 0.30 0.25 0.20 0. Reverse voltage V Fig.3 Series resistance vs. Reverse voltage Rev.1.00, Apr 13, 2004, page (V) R Fig.2 Capacitance vs. Reverse voltage 470MHz – ...

Page 4

... HVL399CM Package Dimensions Rev.1.00, Apr 13, 2004, page 0.10 0.8 – 0.05 1.0 ± 0.05 Package Code JEDEC JEITA Mass (reference value January, 2003 Unit: mm TEFP — — 0.0006 g ...

Page 5

Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble ...

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