HVL142AM Renesas Electronics Corporation., HVL142AM Datasheet
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HVL142AM
Related parts for HVL142AM
HVL142AM Summary of contents
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... An optimal solution for antenna switching in mobile phones. Low capacitance 0.35 pF max) Low forward resistance. (rf = 1.3 max) Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design. Ordering Information Type No. Laser Mark HVL142AM Pin Arrangement Rev.2.00 Jan 19, 2006 page Package Name J TEFP Cathode mark Mark ...
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... HVL142AM Absolute Maximum Ratings Item Reverse voltage V R Forward current I F Power dissipation Pd Junction temperature Tj Storage temperature Tstg Electrical Characteristics Item Symbol Min Reverse current I — R Forward voltage V — F Capacitance C — Forward resistance r — ESD-Capability * — 100 Notes 1. Failure criterion ; I ...
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... HVL142AM Main Characteristic 0.2 0.4 0.6 Forward voltage V Fig.1 Forward current vs. Forward voltage 10 1.0 0.1 0.1 1.0 Reverse voltage V Fig.3 Capacitance vs. Reverse voltage Rev.2.00 Jan 19, 2006 page 0.8 1 (V) Reverse voltage V F Fig.2 Reverse current vs. Reverse voltage ...
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... HVL142AM Fig.5 Forward resistance (parallel) vs. Forward voltage Rev.2.00 Jan 19, 2006 page 100MHz 0.2 0.4 0.6 0.8 Forward voltage V (V) F ...
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... HVL142AM Package Dimensions Package Name JEITA Package Code RENESAS Code TEFP PUSF0002ZA Rev.2.00 Jan 19, 2006 page Previous Code MASS[Typ.] TEFP / TEFPV 0.0006g Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max 0.40 b 0.25 0.30 0.35 c 0.08 0.13 0.18 0.55 0.60 0. ...
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Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble ...