SI8435DB Vishay, SI8435DB Datasheet - Page 7

• Manufacturer Part Number: SI8435DB
• Description: P-channel 1.5-v G-s Mosfet
• Manufacturer: Vishay

PACKAGE OUTLINE
MICRO FOOT: 4-BUMP (2 x 2, 0.8 mm PITCH)
Notes (Unless Otherwise Specified):
1. Laser mark on the silicon die back, coated with a thin metal.
2. Bumps are Sn/Ag/Cu.
3. Non-solder mask defined copper landing pad.
4. The flat side of wafers is oriented at the bottom.
* Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73559.
Document Number: 73559
S-72198-Rev. C, 22-Oct-07
Dim
A
A
A
D
E
S
b
e
1
2
e
Recommended Land
Mark on Backside of Die
X X X
8435
e
0.600
0.260
0.340
0.370
1.520
1.520
0.750
0.370
Min
MILLIMETERS*
Note 3
Solder Mask ∅ ~ 0.40
4 x ∅ 0.30 ~ 0.31
New Product
b Diameter
A
0.650
0.290
0.360
0.410
1.600
1.600
0.850
0.380
Max
A
A
2
1
E
Silicon
e
D
0.0236
0.0102
0.0134
0.0146
0.0598
0.0598
0.0295
0.0146
Min
S
INCHES
Bump Note 2
Vishay Siliconix
S
e
Si8435DB
www.vishay.com
0.0256
0.0114
0.0142
0.0161
0.0630
0.0630
0.0335
0.0150
Max
7