HMP8115 Intersil Corporation, HMP8115 Datasheet - Page 40

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HMP8115

Manufacturer Part Number
HMP8115
Description
Ntsc/pal Video Decoder
Manufacturer
Intersil Corporation
Datasheet
Absolute Maximum Ratings
Digital Supply Voltage (V
Analog Supply Voltage (VAA to GND) . . . . . . . . . . . . . . . . . . . . 7.0V
Digital Input Voltages . . . . . . . . . . . . . . . GND - 0.5V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Temperature Range
HMP8115CN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
42.
Electrical Specifications
POWER SUPPLY CHARACTERISTICS
Power Supply Voltage Range
Total Power Supply Current
Digital Power Supply Current
Analog Power Supply Current
Total Power Dissipation
DC CHARACTERISTICS: DIGITAL I/O (EXCEPT CLK2 and I
Input Logic High Voltage
Input Logic Low Voltage
Output Logic High Voltage
Output Logic Low Voltage
Input Leakage Current
Input/Output Capacitance
Three-State Output Current
Leakage
DC CHARACTERISTICS: CLK2 DIGITAL INPUT
Input Logic High Voltage
Input Logic Low Voltage
Input Leakage Current
Input Capacitance
all leads soldered to printed circuit board.
JA
is measured with the component mounted on an evaluation PC board in free air. Dissipation rating assumes device is mounted with
PARAMETER
CC
to GND) . . . . . . . . . . . . . . . . . . . . 7.0V
V
CC
= V
C
V
SYMBOL
IN
CC
I
P
IH
AA
I
V
V
C
TOT
I
I
V
, C
I
V
V
V
I
CC
TOT
AA
OZ
OH
I
OL
IH
, V
, I
IH
IH
IL
IL
IL
IN
= 5.0V, T
OUT
IL
AA
o
A
CC
C to 70
= 25
(Note 43)
CLK2 = 29.5MHz,
V
Outputs Not Loaded
CLK2 = 29.5MHz,
V
Outputs Not Loaded
V
V
I
I
V
Input = 0V or 5V
f = 1MHz, (Note 43)
All Measurements Referenced to
Ground, T
V
V
V
Input = 0V or V
CLK2 = 1MHz, (Note 43)
All Measurements Referenced to
Ground, T
OH
OL
+ 0.5V
CC
CC
CC
CC
CC
CC
CC
CC
HMP8115
2
o
= 4mA, V
C INTERFACE)
= -4mA, V
C
o
= VAA = 5.25V
= VAA = 5.25V,
= Max
= Min
= Max
= Max
= Min
= Max
C
TEST CONDITION
40
A
A
Thermal Information
Thermal Resistance (Typical, See Note 42)
Maximum Power Dissipation
Maximum Storage Temperature Range . . . . . . . . . .-65
Maximum Junction Temperatures . . . . . . . . . . . . . . . . . . . . . 150
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
= 25
= 25
PQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HMP8115CN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.9W
CC
CC
CC
o
o
C
C
= Min
= Max
0.7xV
- 450
4.75
MIN
2.0
2.4
-
-
-
-
-
-
-
-
-
-
-
-
CC
TYP
1.47
280
105
175
5
8
8
-
-
-
-
-
-
-
-
-
-
0.3xV
MAX
5.25
1.66
315
115
200
0.8
0.4
10
10
-
-
10
-
-
-
-
CC
o
C to 150
JA
UNITS
(
42
mA
mA
mA
o
pF
pF
W
V
V
V
V
V
V
V
C/W)
A
A
A
A
o
o
o
C
C
C

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