DIM200WHS17-A000 Dynex Semiconductor, DIM200WHS17-A000 Datasheet - Page 7
DIM200WHS17-A000
Manufacturer Part Number
DIM200WHS17-A000
Description
Half Bridge Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
1.DIM200WHS17-A000.pdf
(8 pages)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
PACKAGE DETAILS
For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
6(G
7(E
1(E1C2)
2
2
)
)
Module outline type code: W
Fig. 11 Package details
Nominal weight: 420g
2(E2)
4(G
5(E
3(C1)
1
1
)
)
DIM200WHS17-A000
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