BU4S66G2 ROHM Co. Ltd., BU4S66G2 Datasheet - Page 6

• Manufacturer Part Number: BU4S66G2
• Description: Single Analog Switch
• Manufacturer: ROHM Co. Ltd.

●Operation Notes
1. Absolute maximum ratings
2. Connecting the power supply connector backward
3. Power supply lines
4. GND voltage
5. Thermal design
6. Inter-pin shorts and mounting errors
7. Actions in strong electromagnetic field
8. Testing on application boards
9. Ground Wiring Pattern
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external
direction diode can be added.
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the
devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to
exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the
ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor
between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic
values are reduced at low temperatures.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if
pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or
fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when
transporting or storing the IC.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do
not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
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