ECG001 WJ Communications, Inc., ECG001 Datasheet - Page 5

• Manufacturer Part Number: ECG001
• Description: Ingap Hbt Gain Block
• Manufacturer: WJ Communications, Inc.

WJ Communications, Inc x Phone 1-800-WJ1-4401 x FAX: [phone] x e-mail: [e-mail] x Web site: www.wj.com
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes.
ECG001
InGaP HBT Gain Block
Outline Drawing
Land Pattern
ECG001F-G Mechanical Information
The Communications Edge
Specifications and information are subject to change without notice
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with a “4” designator on the top surface of the
package.
marked with a two-digit numeric lot code
followed with a “0” designator; it may also
have been marked with a “00” designator
followed by a letter lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 qC convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of this
2. Add as much copper as possible to inner and outer layers near the
3. Mounting screws can be added near the part to fasten the board to a
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Mounting Config. Notes
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
part to ensure optimal thermal performance.
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
region where the board contacts the heatsink.
construction.
MSL / ESD Rating
Product Marking
The obsolete tin-lead package is
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Product Information
Page 5 of 6 April 2006
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