LT1179 Linear Technology Corporation, LT1179 Datasheet - Page 10

• Manufacturer Part Number: LT1179
• Description: 17?a Max, Dual And Quad, Single Supply, Precision Op Amps
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTIO
LT1178/LT1179
10
NOTE: LEAD DIMENSIONS APPLY TO SOLDER
DIP/PLATE OR TIN PLATE LEADS
(0.203 – 0.457)
NOTE: LEAD DIMENSIONS APPLY
TO SOLDER DIP/PLATE OR TIN
PLATE LEADS
.008 – .018
SEATING
PLANE
(7.62 BSC)
.300 BSC
(0.254 – 1.143)
.010 – .045*
(0.203 – 0.457)
.008 – .018
(7.62 BSC)
.300 BSC
(1.016)
.040
MAX
0° – 15°
0° – 15°
(1.143 – 1.650)
(1.143 – 1.651)
(8.509 – 9.398)
(7.747 – 8.509)
.045 – .068
FULL LEAD
.045 – .065
.335 – .370
.305 – .335
OPTION
DIA
CORNER LEADS OPTION
U
(4 PLCS)
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(1.270)
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
MAX
.050
(0.360 – 0.660)
.014 – .026
8-Lead TO-5 Metal Can (.230 Inch PCD)
OBSOLETE PACKAGES
GAUGE
PLANE
(0.584 – 1.143)
(1.143 – 1.651)
(0.360 – 0.660)
.023 – .045
HALF LEAD
.045 – .065
.014 – .026
(Reference LTC DWG # 05-08-1321)
(Reference LTC DWG # 05-08-1110)
OPTION
(Reference LTC DWG # 05-08-1110)
(12.700 – 19.050)
(4.191 – 4.699)
.165 – .185
.500 – .750
(2.54)
.100
BSC
H Package
J8 Package
J Package
(0.381 – 1.524)
REFERENCE
PLANE
.015 – .060
45°TYP
(5.080)
(3.175)
.200
MAX
.125
MIN
J14 0801
**
*
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
(0.711 – 0.864)
RAD TYP
.028 – .034
(0.635)
.025
(0.127)
.005
MIN
(2.794 – 4.064)
INSULATING
(0.381 – 1.524)
(2.54)
.110 – .160
STANDOFF
.100
BSC
.015 – .060
14
1
(5.080)
(0.406 – 0.533)
MAX
3.175
.200
.125
MIN
.016 – .021**
13
2
RAD TYP
(0.635)
.025
12
(0.127)
3
.005
MIN
(19.939)
MAX
.785
11
4
PIN 1
(0.686 – 1.143)
.027 – .045
10
5
8
1
(0.406 – 0.610)
.016 – .024
9
6
(10.287)
7
2
(5.842)
MAX
.230
.405
TYP
8
7
6
3
H8 (TO-5) 0.230 PCD 0801
(5.588 – 7.874)
5
4
.220 – .310
(5.588 – 7.874)
.220 – .310
J8 0801
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