LTC2753-14 Linear Technology Corporation, LTC2753-14 Datasheet - Page 23

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LTC2753-14

Manufacturer Part Number
LTC2753-14
Description
Ltc2753-14 - Dual Current Output 14-bit Softspan Dacs With Parallel I/o
Manufacturer
Linear Technology Corporation
Datasheet
PACKAGE DESCRIPTION
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 6)
5.15 ± 0.05
7.00 ± 0.10
(4 SIDES)
5.15 ± 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 ±0.05
(Reference LTC DWG # 05-08-1704 Rev C)
48-Lead Plastic QFN (7mm × 7mm)
0.70 ±0.05
(4 SIDES)
5.50 REF
PACKAGE OUTLINE
0.75 ± 0.05
UK Package
6.10 ±0.05 7.50 ±0.05
(4-SIDES)
5.50 REF
R = 0.10
0.200 REF
0.00 – 0.05
TYP
R = 0.115
5.15 ± 0.10
TYP
BOTTOM VIEW—EXPOSED PAD
5.15 ± 0.10
CHAMFER
C = 0.35
PIN 1
0.50 BSC
0.25 ± 0.05
LTC2753
47
(UK48) QFN 0406 REV C
48
23
0.40 ± 0.10
1
2
2753f

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