MR18R1628EG0 Samsung Semiconductor, Inc., MR18R1628EG0 Datasheet - Page 12

• Manufacturer Part Number: MR18R1628EG0
• Description: The Rimm Module Is A General Purpose High- Performance Memory Module Suitable For Use In A Broad Range Of Applications Including Computer Memory, Personal Computers, Workstations And Other Applications Where High Bandwidth And Low Latency Are Requi
• Manufacturer: Samsung Semiconductor, Inc.

MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Physical Dimensions -2 ( For PCB )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of ±0.127[±0.005].
5.68[0.2236]
Min.6.35[0.25]
Min.6.35[0.25]
Min.6.35[0.25]
A-1
B-1
+
+
[0.006
0.15
Note : The gray area above represents the contact surface of the heat spreader.
6.35[0.25]
[0.031
±
±
DETAIL A
0.80
55.175
Figure 4: 256Mb/288Mb base RIMM Module PCB Physical Dimensions
R 2.00
0.10
0.004]
DIA 2.44
±
±
0.10
0.004]
Heat spreader
±
45.00[1.772]
0.08[2.172
DETAIL A
4.50[0.177]
1.00[0.039]
±
0.003]
COMPONENT AREA
COMPONENT AREA
[0.12
1.00[0.039]
2.99
±
133.35
±
0.002]
0.05
(A SIDE)
DETAIL B
11.50[0.453]
(B SIDE)
±
120.65[4.75]
Min.4.88
0.127[5.250
[0.192]
Page 11
±
0.005]
[0.12
3.00
78.175[3.078]
±
±
R 1.00
0.004]
0.10
45.00[1.772]
A-92
DETAIL B
Version 1.0 May 2004
3.00[0.118]
B-92
[0.079
2.00
±
±
0.10
0.004]
+
8.60[0.339]
[0.157
4.00
7.468[0.294]
±
±
0.15
0.006]