CYP15G0401DXB Cypress Semiconductor Corporation., CYP15G0401DXB Datasheet - Page 51

• Manufacturer Part Number: CYP15G0401DXB
• Description: Quad Hotlink Ii Transceiver
• Manufacturer: Cypress Semiconductor Corporation.

Ordering Information
Package Diagram
HOTLink is a registered trademark, and HOTLink II, and MultiFrame are trademarks, of Cypress Semiconductor. CPRI is a
trademark of Siemens AG. IBM and ESCON are registered trademarks, and FICON is a trademark, of International Business
Machines. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-02002 Rev. *L
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Standard
Standard
Standard
Standard
OBSAI
OBSAI
Standard
Standard
Standard
Standard
OBSAI
OBSAI
A1 CORNER I.D.
Speed
C
1.57±0.175
CYP15G0401DXB-BGC
CYP15G0401DXB-BGI
CYV15G0401DXB-BGC
CYV15G0401DXB-BGI
CYW15G0401DXB-BGC
CYW15G0401DXB-BGI
CYP15G0401DXB-BGXC
CYP15G0401DXB-BGXI
CYV15G0401DXB-BGXC
CYV15G0401DXB-BGXI
CYW15G0401DXB-BGXC
CYW15G0401DXB-BGXI
0.60±0.10
0.97 REF.
Ordering Code
SIDE VIEW
TOP VIEW
27.00±0.13
256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
SEATING PLANE
Package
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
BL256
Name
A
0.20(4X)
B
0.15
0.15
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
Pb-free 256-ball Thermally Enhanced Ball Grid Array
C
C
Ø0.75±0.15(256X)
Ø0.15 M C
Ø0.30 M C
A
A
B
0.50 MIN.
Package Type
BOTTOM VIEW (BALL SIDE)
20
19
18
17
16
15
14
13
R 2.5 Max (4X)
12
24.13
A
11
10
9
8
7
CYW15G0401DXB
CYP15G0401DXB
CYV15G0401DXB
6
5
TOP OF MOLD COMPOUND
TO TOP OF BALLS
4
0.20 MIN
3
2
1
51-85123-*E
W
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Y
A1 CORNER I.D.
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
Page 51 of 53
Operating
Range
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